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Sintering of Inkjet-printed Cu-nanoparticle Ink in Ambient Conditions Using a Continuous Wave 808 nm Diode Laser

Published online by Cambridge University Press:  28 February 2013

E. Halonen ,
S. Koskinen ,
I. Leino ,
P. Heljo  and
M. Mäntysalo
E. Halonen
Affiliation:
Tampere University of Technology, Department of Electronics, Korkeakoulunkatu 3, 33720, Tampere, Finland
S. Koskinen
Affiliation:
Tampere University of Technology, Department of Electronics, Korkeakoulunkatu 3, 33720, Tampere, Finland
I. Leino
Affiliation:
Tampere University of Technology, Department of Electronics, Korkeakoulunkatu 3, 33720, Tampere, Finland
P. Heljo
Affiliation:
Tampere University of Technology, Department of Electronics, Korkeakoulunkatu 3, 33720, Tampere, Finland
M. Mäntysalo
Affiliation:
Tampere University of Technology, Department of Electronics, Korkeakoulunkatu 3, 33720, Tampere, Finland
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Abstract

In this paper, we focused on sintering of inkjet-printed copper nanoparticle ink structures using a continuous wave 808nm diode laser. Laser sintering in printed electronics is a rapid sintering method which enables localized sintering. Sintering of Cu inks is usually done in nitrogen atmosphere but the novelty of this study is that successful sintering of Cu ink was done under ambient conditions. The used ink consists of copper nanoparticles covered with a dispersion agent. Photonic sintering is needed to speed up the sintering process to prevent oxidation during sintering. Electrical and mechanical performance of the printed structures was analyzed. Resistivity of 10-12 μΩcm with good repeatability as well as excellent adhesion, were achieved.

Keywords

sinteringnanostructureink-jet printing
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1529: Symposium WW – Roll-to-Roll Processing of Electronics and Advanced Functionalities , 2012 , mrsf12-1529-ww06-15
Copyright
Copyright © Materials Research Society 2013

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