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BCB Based Packaging for Low Actuation Voltage RF MEMS Devices
Published online by Cambridge University Press: 26 February 2011
Abstract
This paper outlines the issues related to RF MEMS packaging and low actuation voltage. It is presented an original approach concerning the modeling of the capacitive contact using multi-physics simulation and advanced characterization. A similar approach is used concerning the packaging development where multi-physic simulations are used to optimize the process. A devoted package architecture is proposed featuring very low loss at microwave range.
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- Copyright © Materials Research Society 2007
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