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Experimental Evaluation of Mechanical Behavior of GaAs Wafer Material
Published online by Cambridge University Press: 26 February 2011
Abstract
The mechanical behavior of non-metalized GaAs wafer material at different temperatures were evaluated. The material properties of GaAs, including the modulus of elasticity, the modulus of rupture, the critical value of stress intensity factor, and the coefficient of thermal expansion, were experimentally determined over various temperature ranges.
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- Copyright © Materials Research Society 1991
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