Hostname: page-component-848d4c4894-hfldf Total loading time: 0 Render date: 2024-05-04T18:27:40.664Z Has data issue: false hasContentIssue false
  • English
  • Français

Inhibition effect of longitudinal alternating current during annealing on growth of interfacial layers of copper cladding aluminum composite

Published online by Cambridge University Press:  22 May 2017

Yongfu Wu ,
Xinhua Liu ,
Yanbin Jiang  and
Jianxin Xie
Yongfu Wu
Affiliation:
Key Laboratory for Advanced Materials Processing of Ministry of Education, Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China; and Laboratory of Aluminum Alloy, Aluminum Corporation of China (CHINALCO) Research Institute of Science and Technology, Beijing 102209, China
Xinhua Liu*
Affiliation:
Key Laboratory for Advanced Materials Processing of Ministry of Education, Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China; and Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, University of Science and Technology Beijing, Beijing 100083, China
Yanbin Jiang
Affiliation:
Key Laboratory for Advanced Materials Processing of Ministry of Education, Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China; and Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, University of Science and Technology Beijing, Beijing 100083, China
Jianxin Xie
Affiliation:
Key Laboratory for Advanced Materials Processing of Ministry of Education, Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China; and Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, University of Science and Technology Beijing, Beijing 100083, China
*
a) Address all correspondence to this author. e-mail: liuxinhua@ustb.edu.cn
Get access

Abstract

The effect of longitudinal alternating current (LAC) on the growth of the interfacial layers of the copper cladding aluminum (CCA) composite flat bar during isothermal annealing was investigated. The results showed that the application of LAC could remarkably inhibit the growth of interfacial compounds as well as improve the interfacial bonding property of the CCA composite. When the CCA flat bars were annealed at temperatures ranging from 723 to 773 K for 1 h with a LAC density higher than 0.625 A/mm2, the total thickness of the interfacial compound layers was reduced by more than 75% in comparison to CCA flat bars annealed without LAC. The reduction of the thickness of the interfacial layers resulted in an improvement of the bonding strength of the CCA composite. The mechanism of the inhibition effect was that the application of LAC could accelerate the vacancy annihilation in component metals.

Keywords

annealingcompositemetallic conductor
Type
Articles
Information
Journal of Materials Research , Volume 32 , Issue 12 , 28 June 2017 , pp. 2335 - 2342
Check for updates
Copyright
Copyright © Materials Research Society 2017 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

Contributing Editor: Yang-T. Cheng

References

REFERENCES

Gibson, A.: Emerging applications for copper-clad steel and aluminum wire. Wire J. Int. 41, 142 (2008).Google Scholar
Perrard, W.: Strategies for optimizing cable design and performance through the use of bimetallic wire. Wire J. Int. 34, 154 (2001).Google Scholar
Yamaguchi, T., Takayama, T., and Hiderita, M.: Method of producing copper clad aluminum wire. U.S. Patent No. 3854193, 1974.Google Scholar
Dion, P.A.: Method of metal cladding. U.S. Patent No. 3408727, 1968.Google Scholar
Rhee, K.Y., Han, W.Y., Park, H.J., and Kim, S.S.: Fabrication of aluminum/copper clad composite using hot hydrostatic extrusion process and its material characteristics. Mater. Sci. Eng., A 384, 70 (2004).Google Scholar
Yoon, D.J., Jeong, H.G., Lim, S.J., Na, K.H., and Kim, E.Z.: Process conditions and interfacial characteristics of Al/Cu clad composite formed by hot hydrostatic extrusion. Mater. Sci. Forum 475–479, 959 (2005).Google Scholar
Xie, J.X., Liu, X.H., and Huang, H.Y.: Horizontal core-filling continuous casting of copper clad aluminum conductor materials. Light Met. Age 73, 64 (2015).Google Scholar
Abbasi, M., Karimi Taheri, A., and Salehi, M.T.: Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process. J. Alloys Compd. 319, 233 (2001).CrossRefGoogle Scholar
Chen, C.Y., Chen, H.L., and Hwang, W.S.: Influence of interfacial structure development on the fracture mechanism and bond strength of aluminum/copper bimetal plate. Mater. Trans. 47, 1232 (2006).Google Scholar
Peng, X.K., Wuhrer, R., Heness, G., and Yeung, W.Y.: On the interface development and fracture behaviour of roll bonded copper/aluminium metal laminates. J. Mater. Sci. 34, 2029 (1999).Google Scholar
Lee, W.B., Bang, K.S., and Jung, S.B.: Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing. J. Alloys Compd. 390, 212 (2005).Google Scholar
Braunovic, M. and Alexandrov, N.: Intermetallic compounds at aluminum-to-copper electrical interfaces: Effect of temperature and electric current. IEEE Trans. Compon., Packag., Manuf. Technol., Part A 17, 78 (1994).Google Scholar
Braunovic, M. and Aleksandrov, N.: Effect of electrical current on the morphology and kinetics of formation of intermetallic phases in bimetallic aluminum–copper joints. In Electrical Contacts, 1993, Proceedings of the Thirty-Ninth IEEE Holm Conference on, Institute of Electrical and Electronics Engineers, eds. (The 39th IEEE Holm Conference on Electrical Contacts, Pittsburgh, USA, 1993); p. 261.Google Scholar
Bertolino, N., Garay, J., Anselmi-Tamburini, U., and Munir, Z.A.: High-flux current effects in interfacial reactions in Au–Al multilayers. Philos. Mag. B 82, 969 (2002).Google Scholar
Friedman, J.R., Garay, J.E., Anselmi-Tamburini, U., and Munir, Z.A.: Modified interfacial reactions in Ag–Zn multilayers under the influence of high DC currents. Intermetallics 12, 589 (2004).Google Scholar
Liu, W.C., Chen, S.W., and Chen, C.M.: The Al/Ni interfacial reactions under the influence of electric current. J. Electron. Mater. 27, L6 (1998).CrossRefGoogle Scholar
Chen, C.M. and Chen, S.W.: Electric current effects on Sn/Ag interfacial reactions. J. Electron. Mater. 28, 902 (1999).CrossRefGoogle Scholar
Chen, S.W. and Wang, C.H.: Effects of electromigration on interfacial reactions in cast Sn/Cu joints. J. Mater. Res. 22, 695 (2007).Google Scholar
Chen, C.M. and Chen, S.W.: Electromigration effects upon the low-temperature Sn/Ni interfacial reactions. J. Mater. Res. 18, 1293 (2003).Google Scholar
Chen, S.W., Chen, C.M., and Liu, W.C.: Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions. J. Electron. Mater. 27, 1193 (1998).Google Scholar
Beke, D.L., Szabó, I.A., Erdélyi, Z., and Opposits, G.: Diffusion-induced stresses and their relaxation. Mater. Sci. Eng., A 387–389, 4 (2004).Google Scholar
Hug, E. and Bellido, N.: Brittleness study of intermetallic (Cu, Al) layers in copper-clad aluminium thin wires. Mater. Sci. Eng., A 528, 7103 (2011).Google Scholar
Wu, Y.F., Liu, X.H., Xie, J.X., Wang, L.Z., and Dong, W.X.: Copper cladding aluminum composite materials with rectangle section fabricated by horizontal core-filling continuous casting. Chin. J. Nonferrous Met. 22, 2500 (2012). (in Chinese).Google Scholar
Wu, Y.F., Liu, X.H., and Xie, J.X.: Rolling process and properties of copper cladding aluminum flat bars using continuous casting bars with rectangle section. J. Univ. Sci. Technol. Beijing 34, 1301 (2012). (in Chinese).Google Scholar
Wu, Y.F., Liu, X.H., and Xie, J.X.: Effect of annealing temperature on texture and properties of copper cladding aluminum flat bar fabricated by continuous casting and subsequent rolling technology. Chin. J. Nonferrous Met. 24, 188 (2013). (in Chinese).Google Scholar
Su, Y.J., Liu, X.H., Huang, H.Y., Liu, X.F., and Xie, J.X.: Interfacial microstructure and bonding strength of copper cladding aluminum rods fabricated by horizontal core-filling continuous casting. Metall. Mater. Trans. A 42, 4088 (2011).CrossRefGoogle Scholar
Wu, Y.F., Liu, X.H., and Xie, J.X.: Interface of copper cladding aluminum composite materials with rectangle section fabricated by horizontal core-filling continuous casting and its evolvement in rolling process. Chin. J. Nonferrous Met. 23, 191 (2013). (in Chinese).Google Scholar
Massalski, T.: The Al–Cu (aluminum–copper) system. J. Phase Equilib. 1, 27 (1980).Google Scholar
Drozdov, M., Gur, G., Atzmon, Z., and Kaplan, W.: Detailed investigation of ultrasonic Al–Cu wire-bonds: II. Microstructural evolution during annealing. J. Mater. Sci. 43, 6038 (2008).Google Scholar
Chen, C.Y. and Hwang, W.S.: Effect of annealing on the interfacial structure of aluminum–copper joints. Mater. Trans. 48, 1938 (2007).Google Scholar
Amistoso, J. and Amorsolo, A.: Thermal aging effects on Cu ball shear strength and Cu/Al intermetallic growth. J. Electron. Mater. 39, 2324 (2010).Google Scholar
Guo, Y., Liu, G., Jin, H., Shi, Z., and Qiao, G.: Intermetallic phase formation in diffusion-bonded Cu/Al laminates. J. Mater. Sci. 46, 2467 (2011).Google Scholar
Tanaka, Y. and Kajihara, M.: Evaluation of interdiffusion in liquid phase during reactive diffusion between Cu and Al. Mater. Trans. 47, 2480 (2006).CrossRefGoogle Scholar
Tanaka, Y. and Kajihara, M.: Numerical analysis for migration of interface between liquid and solid phases during reactive diffusion in the binary Cu–Al system. Mater. Sci. Eng., A 459, 101 (2007).Google Scholar
Kajihara, M.: Analysis of kinetics of reactive diffusion in a hypothetical binary system. Acta Mater. 52, 1193 (2004).Google Scholar
Shewmon, P.: Diffusion in Solids, 2nd ed. (John Wiley & Sons, Inc., New York, 1989); pp. 67–224.Google Scholar
Funamizu, Y. and Watanabe, K.: Interdiffusion in the Al–Cu system. Trans. Jpn. Inst. Met. 12, 147 (1971).Google Scholar
Liu, W. and Cui, J.: The Kirkendall effect of the Al–Cu couple with an electric field. J. Mater. Sci. Lett. 16, 930 (1997).Google Scholar
Fischer, F.D., Svoboda, J., Appel, F., and Kozeschnik, E.: Modeling of excess vacancy annihilation at different types of sinks. Acta Mater. 59, 3463 (2011).Google Scholar
Onodera, Y. and Hirano, K.: The effect of a.c. frequency on precipitation in Al–5.6 at.% Zn. J. Mater. Sci. 19, 3935 (1984).Google Scholar
Onodera, Y. and Hirano, K.: The effect of direct electric current on precipitation in a bulk Al–4 wt% Cu alloy. J. Mater. Sci. 11, 809 (1976).Google Scholar