This paper gives an overview on the standard crystalline silicon solar cell
manufacturing processes typically applied in industry. Main focus has been
put on plasma processes which can replace existing, mainly wet chemical
processes within the standard process flow. Finally, additional plasma
processes are presented which are suited for higher-efficient solar cells,
i.e. for the “passivated emitter and rear cell” concept (PERC) or the
“heterojunction with intrinsic thin layer” approach (HIT). Plasma processes
for the deposition of thin dielectric or semiconducting layers for surface
passivation, emitter deposition or anti-reflective coating purposes are
presented. Plasma etching processes for the removal of phosphorus silicate
glass or parasitic emitters, for wafer cleaning and masked and mask-free
surface texturisation are discussed.