Online ordering is currently unavailable due to technical issues. We apologise for any delays responding to customers while we resolve this. For further updates please visit our website: https://www.cambridge.org/news-and-insights/technical-incident
We use cookies to distinguish you from other users and to provide you with a better experience on our websites. Close this message to accept cookies or find out how to manage your cookie settings.
To save content items to your account,
please confirm that you agree to abide by our usage policies.
If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your account.
Find out more about saving content to .
To save content items to your Kindle, first ensure coreplatform@cambridge.org
is added to your Approved Personal Document E-mail List under your Personal Document Settings
on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part
of your Kindle email address below.
Find out more about saving to your Kindle.
Note you can select to save to either the @free.kindle.com or @kindle.com variations.
‘@free.kindle.com’ emails are free but can only be saved to your device when it is connected to wi-fi.
‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.
Photonics is a field that straddles both the macro and micro worlds. It largely deals with macro-scale devices, but many of these require sub-micron-scale precision in assembly. This makes it a very interesting application domain. We describe a microgripper for microassembly of photonic devices and micro-exploration of the properties of sub-micron attachment means (such as solder and UV epoxy). The microgripper has multi-degree-of-freedom actuation and a unique micro/macro actuator on the gripping axis to facilitate human loading and unloading and also very precise accommodation. We demonstrate the force sensitivity and stiffness of approximately 20 mN and 70 mN/um, respectively to be sufficient for the intended tasks. Finally, we demonstrate the gripper accommodating forces of a large solder ball freezing and cooling as a prelude to our intended study of sub-millimeter solder balls in sub-second heating regimes.
Recommend this
Email your librarian or administrator to recommend adding this to your organisation's collection.