In recent years Metalorganic Chemical Vapor Deposition (MOCVD) becomes a key epitaxial process for a variety of compound semiconductor devices such as: GaAs/AlGaAs lasers, HEMTs, LEDs, photocathodes, solar cells, and MESFETs; InP/InGaAsP long wavelength lasers and detectors; InP/InGaAs quantum wells and detectors, etc. Development of reliable, high throughput equipment is a major task in the implementation of MOCVD into cost-effective manufacturings. We have used Computational Fluid Dynamics (CFD) and Finite Element Analysis (FEA) software to model thermal, structural, and flow processes for the scaling of EMCORE vertical, high speed rotating disk reactor (RDR) to large dimensions (four 4″ wafers located on 12″ wafer carrier). Flow modeling was used to determine basic reactor geometry and the relation between process parameters such as total reactant flow, temperature, pressure, and rotation speed. Thermal and structural analysis was used to produce a uniform substrate temperature, avoid reactor overheating and decrease thermal stress. Flow and temperature distribution predicted by the modeling were found to be well correlated with experimental results.

This work addressed the MBE and EVTE growth of wide band gap semiconductor materials such as MnSe, Cd1-xMnxSe, and MnS1-xSex which have potential application for blue-green light emitters. It is the first time that EVTE was applied for high (Se, S, Cd) and low (Mn) vapor pressure materials, which required modification of the conventional design. The films were grown on GaAs 2° off (100) substrates and characterized using optical microscopy, SEM, EDS, X-ray, SIMS, Hall, and sheet resistance measurements. The deposition process parameters will be reviewed and related to results such as film composition, surface morphology, uniformity, and crystallinity. We report on growth of Cd1-xMnxSe with 0.42<X<0.99 and MnS1_xSex with 0.58<X<0.67. Different methods of controling elemental composition will be discussed. Grown materials show good surface morphlogy and uniformity. SIMS analysis demonstrated stable elemental composition throughout the film thickness and a sharp interface with the substrate.