Epitaxial SnSxSe2−x films with tunable band gap energies (1.0–2.2 eV) are of growing interest for photodetectors and 2D heterostructures for nanoscale electronics. In this study, powder vapor transport growth of SnSxSe2−x was investigated on c-plane sapphire and epitaxial graphene (EG)/6H–SiC substrates using tin, sulfur, and selenium powder sources in a heated tube furnace. The SnSxSe2−x composition was controlled by varying the sulfur and selenium source temperatures and the corresponding chalcogen vapor pressure ratio. Raman spectroscopy was used to determine the alloy composition of the films, and the optical properties were characterized using UV-Vis-NIR spectroscopy. SnSxSe2−x grown on sapphire consisted of vertically oriented platelets. By contrast, large-area, planar coalesced SnSxSe2−x films grew on EG with low surface roughness indicative of a van der Waals growth mode. High-resolution X-ray diffraction θ–2θ scans and pole figure analysis confirm that the SnSxSe2−x films are c-axis oriented with epitaxial relation being $\left[ {11\bar{2}0} \right]$ SnSxSe2−x‖$\left[ {10\bar{1}0} \right]$ 6H–SiC.

In situ curvature measurements were used to compare the stress evolution of GaN films grown directly on 6H-SiC via a two-step temperature growth to films grown with an AlN buffer layer. The two-step temperature growth consisted of an initial low-temperature and a main high-temperature GaN layer. In the case of GaN grown directly on 6H-SiC, the high-temperature layer initiated growth under compressive stress which transitioned to tensile stress. Films grown directly on 6H-SiC exhibited a reduction in the threading dislocation (TD) density and an improvement in the surface roughness compared to growth on the AlN buffer layer. Furthermore, transmission electron microscopy of the GaN grown directly on 6H-SiC revealed predominant (a + c)-type TD along with basal plane stacking faults and $\left\{ {11\bar 20} \right\}$ prismatic stacking faults. Channeling cracks were observed in the GaN film when the AlN buffer layer was not utilized. This was attributed to tensile stress induced from the thermal expansion coefficient mismatch.

In-situ wafer curvature measurements were used to study the effect of Si doping on intrinsic growth stress during the metalorganic chemical vapor deposition (MOCVD) growth of AlxGa1-xN (x=0-0.62) layers on SiC substrates. Post-growth transmission electron microscopy (TEM) characterization was used to correlate measured changes in stress with changes in film microstructure. Si doping was found to result in the inclination of edge-type threading dislocations (TDs) in AlxGa1-xN which resulted in a relaxation of compressive stress and generation of tensile stress. The experimentally measured stress gradient was similar to that predicted by an effective climb model. Dislocation inclination resulted in a reduction in the TD density for Si-doped layers compared to undoped AlxGa1-xN likely due to increased opportunities for dislocation interaction and annihilation. The TD density, which increased with increasing Al-fraction, was found to significantly alter the stress gradients in the films. Film stress was also observed to play a role in TD inclination. In undoped AlxGa1-xN, TD inclination was observed only when the film grew under a compressive stress while in Si-doped AlxGa1-xN, TD inclination was observed independent of the sign or magnitude of the film stress. Si dopants are believed to alter the concentration of surface vacancies which gives rise to dislocation jog via a surface-mediated climb mechanism.

Epitaxially oriented silicon nanowires (SiNWs) were grown on (111) Si substrates by the vapor–liquid–solid technique in an atmospheric-pressure chemical vapor deposition (APCVD) system using Au as the catalyst and SiCl4 as the source gas. The dependencies of SiNW growth rate on the growth temperature and SiCl4 partial pressure (PSiCl4) were investigated, and the experimental results were compared with calculated supersaturation curves for Si obtained from a gas phase equilibrium model of the SiCl4–H2 system. The SiNW growth rate was found to be weakly dependent on temperature but strongly dependent on the PSiCl4, exhibiting a maximum value qualitatively similar to that predicted from the equilibrium model. The results indicate that SiNW growth from SiCl4 is limited by gas phase chemistry and transport of reactant species to the growth surface under APCVD conditions. The experimental results are discussed within the context of a gas phase mass transport model that takes into account changes in equilibrium partial pressure due to curvature-related Gibbs–Thomson effects.

The effect of growth conditions on the composition and structure of Si1−xGex nanowires grown by the vapor–liquid–solid method using gaseous precursors (SiH4 and GeH4) was investigated. Transmission electron microscopy was used to characterize the structural properties and elemental composition of the nanowires. At higher growth temperatures (>425 °C), Ge thin film deposition on the nanowire surface resulted in Au loss during growth and the formation of tapered structures. By simultaneously reducing the growth temperature from 425 to 325 °C to suppress the rate of Ge film deposition and increasing the GeH4/(GeH4 + SiH4) gas ratio, Si1−xGex nanowires were produced with Ge fractions spanning the entire composition range. The Ge fraction follows that predicted from the elemental nanowire growth rates in the Ge-rich (x > 0.5) regime, but deviates to higher Ge fractions in Si-rich (x < 0.5) nanowires. A mechanism was proposed whereby surface diffusion provides an additional pathway to Ge incorporation in Si-rich Si1−xGex nanowires.

We have studied the evolution of stress and microstructure of compositionally graded Al1-xGaxN (0 ≤ x ≤1) buffer layers on (111) Si substrates with varying thicknesses. In-situ stress measurements reveal a tensile-to-compressive stress transition that occurs near the half-thickness in each buffer layer. Cross-sectional transmission electron microscopy (TEM) shows a significant reduction in threading dislocation (TD) density in the top half of the buffer layer, suggesting that the compressive stress enhances the threading dislocation annihilation. The composition of the buffer layers varies linearly with thickness, as determined by X-ray energy dispersive spectrometry (XEDS). The composition grading-induced compressive stress offsets the tensile stress introduced by microstructure evolution, thus yielding a tensile-to-compressive stress transition at x ≈ 0.5.

Extended abstract of a paper presented at Microscopy and Microanalysis 2004 in Savannah, Georgia, USA, August 1–5, 2004.

High density boron-doped silicon nanowire arrays were fabricated within the pores of anodized alumina membranes via vapor-liquid-solid (VLS) growth Anodized alumina membranes with a nominal pore diameter of 200 nm served as templates for the sequential electrodeposition of silver, cobalt, and gold which served as the backside electrical contact, ohmic contact metal and catalyst metal for VLS growth, respectively. Boron-doped silicon nanowires were then synthesized within the pores by VLS growth using silane (SiH4) and trimethylboron (TMB) gas sources. Arrays of Al dots were deposited on the top surface of the membrane after nanowire growth. A series of samples was prepared with different SiNW lengths and boron doping levels. Two point probe measurements were used to measure the I-V characteristics of the silicon nanowire arrays before and after annealing. Nanowire resistivity and contact resistance were determined from plots of resistance versus nanowire length. The resistivity of the SiNW was observed to decrease with the addition of TMB during growth.

Thin films of InN were grown on (0001) Sapphire by MOCVD. The effect of growth conditions and buffer layer on the film morphology was studied. Growth temperature and TMI flow rate were important factors in the growth of InN. The use of a low temperature AlN buffer layer was also found to improve the morphology and crystal quality of the films. Thin (<40Å) AlN buffer layers produced the best results while polycrystalline InN was obtained when the buffer layer thickness exceeded 60Å. Delamination of the InN films was observed to occur at growth temperature, which limited the thickness of the films to less than 300 nm. A room temperature mobility of 792 cm2/Vs and an electron concentration of 2.1×1019 cm-3 were measured in an approximately 200 nm thick InN layer grown on sapphire.

Current collapse effects in an Al0.25Ga0.75N/GaN HFET have been investigated under pulsed bias conditions, and a detailed investigation of current responses to changes in drain or gate bias voltage (drain-lag and gate-lag, respectively) has been performed. Three components of transient current response to changes in drain and gate bias voltages are distinguished. Surface treatment using KOH etching and the influence of pulsed bias conditions on threshold voltage are investigated to explore the origins of traps associated with each current transient component.

Piezoelectric AlGaN/GaN FETs on SiC with high carrier mobility have been fabricated yielding IDS=450 mA/mm and gm=200 mS/mm. In the on-state, under UV-illumination, the devices sustain a drain voltage of VDS=49 V, corresponding to a power dissipation of 26.5 W/mm. On turn-on of the device from the pinch-off state, a significant delay in the drain current build-up is observed. This effect depends on the pinch-off time and the pinch-off voltage and can be removed by either a brief UV-illumination or a VDS>25 V applied in the on-state. The drain current transients are characterized by a relaxation time τ, which is in the order of several hundred seconds. From the temperature dependence of τ, an activation energy of about 280 meV and a capture cross section of 4.4·10−18cm2 were determined. The devices show pronounced persistent photoconductivity (PPC) and the drain current ID is sensitive to illumination.

Au Schottky diodes were prepared by vacuum evaporation or by plasma sputtering on n-AlGaN(Si) films with Al mole fractions of 0, 0.11 or 0.23. The barrier heights were deduced from C-V and I-T measurements. The difference between the C-V and I-T results was less than 0.1 eV for the barriers deposited at 300 °C on HF etched samles with prior in situ heating at 450 °C. For low deposition temperatures (about 150°C) C-V and I-T methods give results differing by some tenths of an eV. For deposition temperatures exceeding 450°C the diodes were very leaky. The barrier heights were 0.8 eV, 0. 9 eV and 1.1 eV for AlGaN with compositions of 0, 0.11 and 0.23. For plasma sputtered diodes on GaN and AlGaN (x=0.11) samples, the difference in C-V and I-T results was quite considerable and admittance spectroscopy indicated the presence of deep electron traps at 0.12-0.14 eV that were absent in vacuum evaporated diodes. For similar diodes on AlGaN(x=0.23) samples the results of C-V and I-T measurements were very close and no traps at 0.12-0.14 eV could be detected. This difference is most likely due to damage caused by low energy ions. More Al-rich films are less susceptible to such damage. Persistent photocapacitance was observed in n-AlGaN Schottky diodes after illumination at 85K.