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Stress corrosion of organosilicate glass films in aqueous environments: Role of pH

  • F. Iacopi (a1), C. Elia (a2), T. Fournier (a3), F. Sinapi (a1) and Y. Travaly (a1)...

Subcritical cracking of thin glass films caused by stress-corrosion phenomena cannot be neglected when it comes to application and manufacturing processes that involve exposure to aqueous environments. A protocol is introduced to allow for a quantitative study of stress corrosion through channel cracking experiments. By this method, an exponential dependence of the crack propagation rate on the pH of the aqueous environment is revealed. Therefore, this behavior should be accounted for through the use of an appropriate pre-exponential factor in the expression of channel cracking rate. This factor should reflect the reduced crack resistance of the glass film caused by the weakening of the silica bonds behind the crack tip in the aqueous environment. A direct comparison between commercial slurries and reference solutions confirms that the crack resistance is a function of the pH of the ambient.

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1K. Maex , M.R. Baklanov , D. Shamiryan , F. Iacopi , S.H. Brongersma , Z.S. Yanovitskaya : Low-dielectric constant materials for microelectronics. J. Appl. Phys. 93, 87932003

2F. Iacopi , S.H. Brongersma , B. Vandevelde , M. O’Toole , D. Degryse , Y. Travaly , K. Maex : Challenges for structural stability of ultra-low-k-based interconnects. Microelectron. Eng .75(1), 542004

4R.K. Singh , R. Bajaj : Advances in chemical–mechanical planarization. Mater. Res. Soc. Bull. 27(10), 7432002

5R.F. Cook , Z. Suo : Mechanisms active during fracture under constraint. Mater. Soc. Bull. 27, 452002

6R.F. Cook , E.G. Liniger : Stress-corrosion cracking of low-dielectric constant spin-on-glass thin films. J. Electrochem. Soc. 146(12), 44391999

7T.Y. Tsui , A.J. Griffin , R. Fields , J.M. Jacques , A. McKerrow , J.J. Vlassak : The effect of elastic modulus on channel crack propagation in organosilicate glass films. Thin Solid Films 515(4), 22572006

8T.Y. Tsui , A.J. McKerrow , J.J. Vlassak : Constraints effects on thin film channel cracking behavior. J. Mater. Res. 20(9), 22662005

9S.M. Wiederhorn , H. Johnson : Influence of sodium-hydrogen ion-exchange on crack propagation in soda-lime silicate glass. J. Am. Ceram. Soc. 56(2), 1081973

10E.P. Guyer , R.H. Dauskardt : Fracture of nanoporous thin-film glasses. Nat. Mater. 3, 532004

12M.R. Baklanov , K.P. Mogilnikov , V.G. Polovinkin , F.N. Dultsev : Determination of pore-size distribution in thin films by ellipsometric porosimetry. J. Vac. Sci. Technol., B 18(3), 13852000

13F. Iacopi , Y. Travaly , M. Van Hove , A.M. Jonas , J.M. Molina-Aldareguia , M.R. Elizalde , I. Ocaña : Extent of plasma damage to porous organosilicate films characterized with nanoindentation, x-ray reflectivity and surface acoustic waves. J. Mater. Res. 21(12), 31612006

14J.L. Beuth Jr.: Cracking of thin bonded films in residual tension. Int. J. Solids Struct. 29, 16571992

15E. Guyer , R.H. Dauskardt : Effect of solution pH on the accelerated cracking of nanoporous thin-film glasses. J. Mater. Res. 20(3), 6802005

18S.M. Wiederhorn , H. Johnson : Effect of the electrolyte pH on crack propagation in glass. J. Am. Ceram. Soc. 56(4), 1921973

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Journal of Materials Research
  • ISSN: 0884-2914
  • EISSN: 2044-5326
  • URL: /core/journals/journal-of-materials-research
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