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    This article has been cited by the following publications. This list is generated based on data provided by CrossRef.

    Zhao, Guangfeng Liu, Ming An, Zhinan Ren, Yang Liaw, Peter K. and Yang, Fuqian 2013. Electromechanical responses of Cu strips. Journal of Applied Physics, Vol. 113, Issue. 18, p. 183521.


    Larson, B. C. and Levine, L. E. 2013. Submicrometre-resolution polychromatic three-dimensional X-ray microscopy. Journal of Applied Crystallography, Vol. 46, Issue. 1, p. 153.


    Zhao, Guangfeng and Yang, Fuqian 2012. Effect of alternating electric current on the nanoindentation of copper. Applied Physics A, Vol. 109, Issue. 3, p. 553.


    Zhang, H. and Cargill, G.S. 2011. Electromigration in Thin Films and Electronic Devices.


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Electromigration-induced strain relaxation in Cu conductor lines

  • H. Zhang (a1) and G.S. Cargill (a2)
  • DOI: http://dx.doi.org/10.1557/jmr.2011.2
  • Published online: 01 February 2011
Abstract
Abstract

Strain evolution in 0.45-μm-thick, 2-μm-wide, and 100-μm-long Cu conductor lines with a passivation layer has been investigated using synchrotron x-ray microdiffraction. A moderate electromigration-current density of 2.2 × 105 A/cm2 was used to minimize Joule heating in the Cu conductor lines. After 120 h of current flowing in the Cu lines at 270 °C, measurements show strain relaxation and homogenization occurring in the Cu lines with current flowing, but not in Cu conductor lines without current. Stronger interaction between electrons with Cu atoms in areas with higher strains was proposed to explain the observation.

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a)Address all correspondence to this author: e-mail: hoz204@lehigh.edu
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Journal of Materials Research
  • ISSN: 0884-2914
  • EISSN: 2044-5326
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