Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Seo, Sun-Kyoung
Kang, Sung K.
Shih, Da-Yuan
and
Lee, Hyuck Mo
2009.
An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate.
Journal of Electronic Materials,
Vol. 38,
Issue. 2,
p.
257.
Cho, Moon Gi
Kim, Hyun You
Seo, Sun-Kyoung
and
Lee, Hyuck Mo
2009.
Enhancement of heterogeneous nucleation of β-Sn phases in Sn-rich solders by adding minor alloying elements with hexagonal closed packed structures.
Applied Physics Letters,
Vol. 95,
Issue. 2,
Cho, Moon Gi
Seo, Sun-Kyoung
and
Lee, Hyuck Mo
2009.
Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-<I>x</I>Zn Alloy Under Bump Metallurgies.
MATERIALS TRANSACTIONS,
Vol. 50,
Issue. 9,
p.
2291.
Yu-chih Huang
Kuang-siang Wu
and
Sinn-wen Chen
2009.
Size and substrate effects upon undercooling of Pb-free solders.
p.
662.
Cho, Moon Gi
Kang, Sung K.
Seo, Sun-Kyoung
Shih, Da-Yuan
and
Lee, Hyuck Mo
2009.
Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging.
Journal of Electronic Materials,
Vol. 38,
Issue. 11,
p.
2242.
Cho, Moon Gi
Kang, Sung K.
Seo, Sun-Kyoung
Shih, Da-Yuan
and
Lee, Hyuck Mo
2009.
Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders.
Journal of Materials Research,
Vol. 24,
Issue. 2,
p.
534.
Seo, Sun-Kyoung
Kang, Sung K.
Cho, Moon Gi
Shih, Da-Yuan
and
Lee, Hyuck Mo
2009.
The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy.
Journal of Electronic Materials,
Vol. 38,
Issue. 12,
p.
2461.
ZHOU, Minbo
LI, Xunping
MA, Xiao
and
ZHANG, Xinping
2010.
EARLY INTERFACIAL REACTION AND UNDER-COOLING SOLIDIFICATION BEHAVIOR OF Sn--3.5Ag/Cu SYSTEM.
ACTA METALLURGICA SINICA,
Vol. 46,
Issue. 5,
p.
569.
Huang, Yu-chih
Chen, Sinn-wen
and
Wu, Kuang-siang
2010.
Size and Substrate Effects upon Undercooling of Pb-Free Solders.
Journal of Electronic Materials,
Vol. 39,
Issue. 1,
p.
109.
Seo, Sun-Kyoung
Cho, Moon Gi
and
Lee, Hyuck Mo
2010.
Crystal orientation of β-Sn grain in Ni(P)/Sn–0.5Cu/Cu and Ni(P)/Sn–1.8Ag/Cu joints.
Journal of Materials Research,
Vol. 25,
Issue. 10,
p.
1950.
Sidhu, Rajen S.
Aspandiar, Raiyo
Vandervoort, Steve
Amir, Dudi
and
Murtagian, Gregorio
2011.
Impact of processing conditions and solder materials on surface mount assembly defects.
JOM,
Vol. 63,
Issue. 10,
p.
47.
Liu, Chao Sheng
Ho, Cheng En
Peng, Cheng Sam
and
Kao, C. Robert
2011.
Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints.
Journal of Electronic Materials,
Vol. 40,
Issue. 9,
p.
1912.
Zhou, M. B.
Ma, X.
and
Zhang, X. P.
2012.
Undercooling Behavior and Intermetallic Compound Coalescence in Microscale Sn-3.0Ag-0.5Cu Solder Balls and Sn-3.0Ag-0.5Cu/Cu Joints.
Journal of Electronic Materials,
Vol. 41,
Issue. 11,
p.
3169.
Kang, Sung K.
2012.
Lead‐Free Solders: Materials Reliability for Electronics.
p.
119.
Kim, Young Min
Kim, Sun-Chul
and
Kim, Young-Ho
2013.
An eco-friendly Cu-Zn wetting layer for highly reliable solder joints.
p.
755.
Abdelhadi, Ousama M.
and
Ladani, Leila
2013.
Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints.
Journal of Electronic Packaging,
Vol. 135,
Issue. 2,
Schindler, Sebastian
Mueller, Maik
and
Wiese, Steffen
2014.
Investigation of the undercooling of SnCu solder spheres.
p.
1.
Zhang, Lang
Zhou, Min-Bo
and
Zhang, Xin-Ping
2014.
Influence of solder volume and interfacial reaction on the undercooling and solidification microstructure of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints.
p.
251.
Belyakov, S.A.
and
Gourlay, C.M.
2014.
Heterogeneous nucleation of βSn on NiSn4, PdSn4 and PtSn4.
Acta Materialia,
Vol. 71,
Issue. ,
p.
56.
Gourlay, C. M.
Belyakov, S. A.
Ma, Z. L.
and
Xian, J. W.
2015.
Nucleation and Growth of Tin in Pb-Free Solder Joints.
JOM,
Vol. 67,
Issue. 10,
p.
2383.