Copper films were prepared at room temperature under a
Cu(hfac)2-Ar-H2 atmosphere in order toobtain
metallized plastics by using ECR-MOCVD (Electron Cyclotron Resonance Metal
OrganicChemical Vapor Deposition) coupled with a DC bias system. Structural
analysis of the films byECR showed that fine copper grains were embedded in
an amorphous plastic matrix with goodadherence. Considering the AES result
of the film prepared by ECR-CVD, we construe that thecopper film is
chemically bonded with a plastic substrate. The delamination force
determined bythe nano-scratch tester® showed in the range from 10 to
20mN.