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Chemical–mechanical polishing of copper and tantalum with silica abrasives
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- Journal:
- Journal of Materials Research / Volume 16 / Issue 4 / April 2001
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1066-1073
- Print publication:
- April 2001
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Planarization of Cu and Ta Using Silica and Alumina Abrasives - A Comparison
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- Journal:
- MRS Online Proceedings Library Archive / Volume 613 / 2000
- Published online by Cambridge University Press:
- 14 March 2011, E2.4.1
- Print publication:
- 2000
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Role of Film Hardness on the Polish Rates of Metal Thin Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 566 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 123
- Print publication:
- 1999
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Mechanism of Cu removal during CMP in H2O2-glycine based slurries
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- Journal:
- MRS Online Proceedings Library Archive / Volume 566 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 129
- Print publication:
- 1999
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