17 results
Combination of Soft X-Ray Microscopy with In-Situ Mechanical Testing to Image Crack Propagation in Microchips
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- Journal:
- Microscopy and Microanalysis / Volume 24 / Issue S2 / August 2018
- Published online by Cambridge University Press:
- 10 August 2018, pp. 438-439
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- August 2018
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In-situ X-ray Microscopy of Crack-Propagation to Study Fracture Mechanics of On-Chip Interconnect Structures
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- MRS Advances / Volume 3 / Issue 39 / 2018
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- 29 April 2018, pp. 2305-2310
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- 2018
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FIB sample preparation for X-ray microscopy and ROI target cross-sectioning
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- Microscopy and Microanalysis / Volume 22 / Issue S3 / July 2016
- Published online by Cambridge University Press:
- 25 July 2016, pp. 168-169
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- July 2016
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A Study of Gallium FIB induced Silicon Amorphization using TEM, APT and BCA Simulation
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- Microscopy and Microanalysis / Volume 21 / Issue S3 / August 2015
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- 23 September 2015, pp. 1839-1840
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- August 2015
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In-Situ Investigations of Individual Nanowires within a FIB/SEM System
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- Microscopy and Microanalysis / Volume 20 / Issue S3 / August 2014
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- 27 August 2014, pp. 360-361
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- August 2014
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X-ray Microscopy and Tomography of Hydrogen Storage Materials
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- Microscopy and Microanalysis / Volume 20 / Issue S3 / August 2014
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- 27 August 2014, pp. 1568-1569
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- August 2014
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The effect of the pore topology on the elastic modulus of organosilicate glasses
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- Journal of Materials Research / Volume 28 / Issue 9 / 14 May 2013
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- 16 April 2013, pp. 1262-1268
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- 14 May 2013
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Elastic anisotropy of Cu and its impact on stress management for 3D IC: Nanoindentation and TCAD simulation study
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- Journal of Materials Research / Volume 27 / Issue 1 / 14 January 2012
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- 21 October 2011, pp. 339-348
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- 14 January 2012
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Grain structure effect on electromigration reliability of Cu interconnects with CoWP capping
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- Journal of Materials Research / Volume 26 / Issue 21 / 14 November 2011
- Published online by Cambridge University Press:
- 11 October 2011, pp. 2757-2760
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- 14 November 2011
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Chemical Bonding, Permittivity and Elastic Properties in Locally Modified Organosilicate Glass
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- MRS Online Proceedings Library Archive / Volume 914 / 2006
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- 01 February 2011, 0914-F11-03
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- 2006
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Characterization of Chemical Bonding in Low-K Dielectric Materials for Interconnect Isolation: A XAS and EELS Study
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- MRS Online Proceedings Library Archive / Volume 914 / 2006
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- 01 February 2011, 0914-F01-08
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- 2006
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Microstructural Evaluation of Degradation Mechanisms in Thermally Treated TaSiN Diffusion Barriers for Cu Interconnects
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- Microscopy and Microanalysis / Volume 10 / Issue S02 / August 2004
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- 01 August 2004, pp. 616-617
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- August 2004
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Effect of mass transport along interfaces and grain boundaries on copper interconnect degradation
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- MRS Online Proceedings Library Archive / Volume 812 / 2004
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- 17 March 2011, F7.5
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- 2004
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Quantitative EELS of nitrided gate oxides
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- Microscopy and Microanalysis / Volume 9 / Issue S03 / September 2003
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- 05 September 2003, pp. 96-97
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- September 2003
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Microstructure and degradation mechanisms of TaSiN diffusion barriers for Cu interconnects
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- Microscopy and Microanalysis / Volume 9 / Issue S03 / September 2003
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- 05 September 2003, pp. 248-249
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- September 2003
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Electron tomography of inlaid copper interconnect structures
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- Microscopy and Microanalysis / Volume 9 / Issue S03 / September 2003
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- 05 September 2003, pp. 270-271
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- September 2003
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Crystallographic Texture Characterization of Inlaid Copper Interconnects
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- MRS Online Proceedings Library Archive / Volume 672 / 2001
- Published online by Cambridge University Press:
- 21 March 2011, O7.9
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- 2001
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