31 results
Formation and morphology of Kurnakov type D022 compound in disordered face-centered cubic γ–(Ni, Fe) matrix alloys
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- Journal of Materials Research / Volume 21 / Issue 1 / January 2006
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- 01 January 2006, pp. 21-26
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- January 2006
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Phase Equilibria in the Sn-Rich Corner of the Sn–Cu–Ni Ternary Alloy System at 240 °C
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- Journal of Materials Research / Volume 20 / Issue 11 / November 2005
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- 03 March 2011, pp. 3118-3124
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- November 2005
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Crystallization Behavior and Microhardness Evolution in Al92−xNi8Lax Amorphous Alloys
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- Journal of Materials Research / Volume 20 / Issue 11 / November 2005
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- 03 March 2011, pp. 2927-2933
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- November 2005
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Shear Strength of Sn–3.5Ag Solder Bumps Formed on Ni/Au and Organic Solderability Preservative Surface-Finished Bond Pads After Multiple Reflow Steps
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- Journal of Materials Research / Volume 20 / Issue 11 / November 2005
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- 03 March 2011, pp. 3088-3093
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- November 2005
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Numerical analysis for co-condensation processes in silicide nanoparticle synthesis using induction thermal plasmas at atmospheric pressure conditions
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- Journal of Materials Research / Volume 20 / Issue 10 / October 2005
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- 03 March 2011, pp. 2801-2811
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- October 2005
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Impurity Effects on the Environmental Stability of Powder Processed Intermetallic Alumino-Silicide Compounds
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- Journal of Materials Research / Volume 20 / Issue 10 / October 2005
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- 03 March 2011, pp. 2691-2704
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- October 2005
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Nickel silicon thin film as barrier in under-bump-metallization by magnetronsputtering deposition for Pb-free chip packaging
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- Journal of Materials Research / Volume 20 / Issue 10 / October 2005
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- 03 March 2011, pp. 2622-2626
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- October 2005
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Mechanical Properties of Intermetallic Compounds in the Au–Sn System
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- Journal of Materials Research / Volume 20 / Issue 8 / August 2005
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- 01 August 2005, pp. 2161-2172
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- August 2005
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Damages and Microstructural Variation of High-lead and Eutectic SnPb Composite Flip Chip Solder Bumps Induced by Electromigration
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- Journal of Materials Research / Volume 20 / Issue 8 / August 2005
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- 01 August 2005, pp. 2184-2193
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- August 2005
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Effects of Cu Contents in Sn–Cu Solder on the Composition and Morphology of Intermetallic Compounds at a Solder/Ni Interface
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- Journal of Materials Research / Volume 20 / Issue 8 / August 2005
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- 01 August 2005, pp. 2205-2212
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- August 2005
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Role of Interface Boundaries in the Deformation Behavior of TiAl Polysynthetically Twinned Crystal: In situ Transmission Electron Microscopy Deformation Study
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- Journal of Materials Research / Volume 20 / Issue 7 / July 2005
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- 01 July 2005, pp. 1888-1901
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- July 2005
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Microstructure and wear resistance of Cuss-toughened Cr5Si3/CrSi metal silicide alloys
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- Journal of Materials Research / Volume 20 / Issue 5 / May 2005
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- 03 March 2011, pp. 1122-1130
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- May 2005
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A new high-strength spinodal alloy
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- Journal of Materials Research / Volume 20 / Issue 4 / April 2005
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- 01 April 2005, pp. 791-795
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- April 2005
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Ductility of cold-rolled and recrystallized Ni3Al foils
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- Journal of Materials Research / Volume 20 / Issue 4 / April 2005
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- 01 April 2005, pp. 1054-1062
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- April 2005
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Initial study of strengthening of NiAl–Cr(Mo)–Hf alloys by strong magnetic field
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- Journal of Materials Research / Volume 20 / Issue 2 / February 2005
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- 03 March 2011, pp. 295-298
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- February 2005
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Stability of Fe-Based Alloys With Structure Type C6Cr23
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- Journal of Materials Research / Volume 20 / Issue 1 / January 2005
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- 03 March 2011, pp. 237-242
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- January 2005
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Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C
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- Journal of Materials Research / Volume 19 / Issue 12 / December 2004
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- 01 December 2004, pp. 3560-3568
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- December 2004
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Hydrogen storage properties of mechanically alloyedMg–8 mol% LaNi0.5 composite
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- Journal of Materials Research / Volume 19 / Issue 10 / October 2004
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- 01 October 2004, pp. 2871-2876
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- October 2004
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Nickel aluminum superalloys created by the self-propagating high-temperature synthesis of nanoparticle reactants
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- Journal of Materials Research / Volume 19 / Issue 10 / October 2004
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- 01 October 2004, pp. 3028-3036
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- October 2004
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Relationship of glass formation ability and eutectics in ternary Ni–Zr–B system
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- Journal of Materials Research / Volume 19 / Issue 9 / September 2004
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- 03 March 2011, pp. 2523-2526
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- September 2004
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