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Effects of Refraction and Reflection on Analysis of Thin Films by the Grazing-Incidence X-ray Diffraction Method

Published online by Cambridge University Press:  06 March 2019

Toru Takayama
Affiliation:
Research and Development Division Sumitomo Metal Industries, Ltd. Nishinagasu-Hondori, Amagasaki, 660 Japan
Yoshiro Matsumoto
Affiliation:
Research and Development Division Sumitomo Metal Industries, Ltd. Nishinagasu-Hondori, Amagasaki, 660 Japan
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Abstract

The grazing-incidence X-ray diffraction (GIXD) method was employed to analyze two-layer thin films, which were the samples of Å lOO Å Au/500Å Cu/Si02 (substrate) and 250Å Cu/500Å Au/SiO2(substrate), which were prepared by the evaporation technique under the condition that the SiO2 substrate was at room temperature. Diffraction profiles were obtained at various glancing angles ( α ) and the data were analyzed as a function of α. The results were as follows : 1) Diffraction peaks were shifted to larger diffraction angles, because of the refraction of the incident X-ray beam. The angular shift has been approximated by the equation, α - α2- αc2)1/2, where αc is the total ref reflection critical angle of the material. 2) As a result of the correction of angular shift, the stress of the evaporated films was estimated to be null. 3) The broadening of the Cu diffraction peak and the enhancement of the Cu diffraction intensity occurred at angles near αc of Cu, due to the reflection of the X-ray beam at the Cu/Au interface.

Type
Research Article
Copyright
Copyright © International Centre for Diffraction Data 1989

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