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Hybrid cured thiol-ene/epoxy networks for core-shell semiconductorpackaging

Published online by Cambridge University Press:  26 January 2016

Kayla V. Maaraoui ,
Gregory Ellson  and
Walter Voit
Kayla V. Maaraoui
Affiliation:
Healthcare Management, University of Texas at Dallas, 800 W Campbell Rd, Richardson, TX 75080, U.S.A.
Gregory Ellson*
Affiliation:
Materials Science and Engineering, University of Texas at Dallas, 800 W Campbell Rd, Richardson, TX 75080, U.S.A.
Walter Voit
Affiliation:
Materials Science and Engineering, University of Texas at Dallas, 800 W Campbell Rd, Richardson, TX 75080, U.S.A.
*
*(Email: gte130030@utdallas.edu)
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Abstract

This research describes thiol-ene/epoxy hybrid networks for core-shellencapsulation of semiconductor devices. A thiol-ene network was formed usingultraviolet-induced radical polymerization, with unreacted thiols and epoxidemonomers remaining in the network. Immersion in tributylamine catalyzed thethiol-epoxy coupling to produce a diffusion-limited hard outer shell. Tensiletesting shows that the initial thiol-ene product (core) has elastomericbehavior, while the secondary curing creates a glassy material (shell) at roomtemperature due to thiol-epoxy coupling. Bulk samples of the material form ahard outer shell surrounding a soft core depending on the secondary cureconditions. There are positive relationships between wall thickness andsecondary cure temperature and cure time, enabling control of shell thickness byvarying reaction conditions. Shell thicknesses were measured up to 1.8 mm whenimmersed in tributylamine for up to 150 minutes and up to 140 °C. Theability to control core-shell thickness of dual-cured networks is applicable indevice encapsulation processes. Core-shell encapsulants for microelectronics mayprovide further shock and impact protection for durable electronic devices.Further aging and operational studies will be needed to determine time-stabilityand optimal processing of the core-shell structure.

Keywords

polymerpackagingcore/shell

Information

Type
Articles
Information
MRS Advances , Volume 1 , Issue 1: Biomaterials and Soft Materials , 2016 , pp. 57 - 62
Copyright
Copyright © Materials Research Society 2016 

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References

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