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Photonic Curing of Copper Ink Films on Liquid Crystal Polymer Substrate

Published online by Cambridge University Press:  29 June 2020

Andrew Luce ,
Guinevere Strack ,
Oshadha Ranasingha ,
Edward Kingsely ,
Craig Armiento  and
Alkim Akyurtlu
Andrew Luce
Affiliation:
Printed Electronics Research Collaborative (PERC), Raytheon–UMass Lowell Research Institute (RURI), Department of Electrical and Computer Engineering, University of Massachusetts Lowell, Lowell, MA01854
Guinevere Strack*
Affiliation:
Printed Electronics Research Collaborative (PERC), Raytheon–UMass Lowell Research Institute (RURI), Department of Electrical and Computer Engineering, University of Massachusetts Lowell, Lowell, MA01854
Oshadha Ranasingha
Affiliation:
Printed Electronics Research Collaborative (PERC), Raytheon–UMass Lowell Research Institute (RURI), Department of Electrical and Computer Engineering, University of Massachusetts Lowell, Lowell, MA01854
Edward Kingsely
Affiliation:
Printed Electronics Research Collaborative (PERC), Raytheon–UMass Lowell Research Institute (RURI), Department of Electrical and Computer Engineering, University of Massachusetts Lowell, Lowell, MA01854
Craig Armiento
Affiliation:
Printed Electronics Research Collaborative (PERC), Raytheon–UMass Lowell Research Institute (RURI), Department of Electrical and Computer Engineering, University of Massachusetts Lowell, Lowell, MA01854
Alkim Akyurtlu*
Affiliation:
Printed Electronics Research Collaborative (PERC), Raytheon–UMass Lowell Research Institute (RURI), Department of Electrical and Computer Engineering, University of Massachusetts Lowell, Lowell, MA01854
*
*Corresponding authors: Guinevere_Strack@uml.edu and Alkim_Akyurtlu@uml.edu
*Corresponding authors: Guinevere_Strack@uml.edu and Alkim_Akyurtlu@uml.edu
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Abstract

The application of intense pulsed light (IPL) to printed copper nanoparticle (CuNP) films enables rapid curing on low temperature substrates in ambient conditions. In this work, we printed CuNP ink on liquid crystal polymer (LCP; Vectra A resin) and then cured the films using a high energy density light pulse. High-resolution SEM images of the cured films revealed that the CuNPs on LCP were fused together. Optimal curing parameters were a 5 ms pulse, 75% duty cycle, and an energy density range of 4.2–5.2 J⋅cm-2. Sheet resistance, Rs, values as low as ~0.1 Ω⋅sq-1were obtained. The LCP substrate took on a yellowed appearance after the application of five pulses and exhibited a surface free energy increase. A filter that blocked wavelengths <450 nm was placed over the printed copper film on LCP. As expected, the presence of the filter decreased the total energy density and produced a cured film with high Rs; however, when the energy density was increased in the presence of the filter, the Rs remained high (0.95 Ω⋅sq-1). This preliminary work indicates that additional studies are required not only to understand low thermal budget curing on LCP, but also to elucidate the properties of substrates that enable low Rs.

Type
Articles
Information
MRS Advances , Volume 5 , Issue 42: Nanoscale and Quantum Materials , 2020 , pp. 2191 - 2199
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Copyright
Copyright © Materials Research Society 2020

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References

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