As revolutionary as microelectronics has been as a technology, there are functions that it does not address. Microelectronics focuses on ever-smaller integrated circuits (ICs) in ever-fewer square millimeters of space to increase clock speeds and decrease the power required for computer processing functions. However, applications requiring control, communications, computing, and sensing over a large area are difficult or costprohibitive to achieve because of the material incompatibilities of traditional ICs with structures, materials, and manufacturing technology. Macroelectronics addresses these applications with the aim of providing active control circuitry in situ over areas of many square meters for displays, solar panels, x-ray imagers, surface measurements, structural shape control, vehicle health monitoring, and other large-system applications. The materials challenges of macroelectronics integrated circuits (MEICs) reviewed in this issue include lightweight flexible substrates, thin-film transistors (TFTs) with IC or near-IC performance, modeling, and manufacturing technology. Compatible component materials, flexible substrates, processing conditions, host system composition, and functionality provide grand challenges that are just beginning to be addressed by researchers.

Organic thin-film transistors (OTFTs) are considered indispensable in applications requiring flexibility, large area, low processing temperature, and low cost. Key challenges to be addressed include developing solution-processable gate dielectric materials that form uniform films over large areas and exhibit excellent insulating properties, reducing contact resistance at interfaces between organic semiconductors and electrodes, and optimizing the patterning of organic semiconductors. High-performance pentacene-based OTFTs have been reported with polymeric gate dielectrics and indium tin oxide source/drain electrodes. Using such OTFT backplates, a 15-in. 1024 X 768 pixel full-color active-matrix liquid-crystal display (AMLCD) and a 4.5-in. 192 X64 pixel active-matrix organic light-emitting diode (AMOLED) have been fabricated.

Low-defect-density polycrystalline Si on flexible substrates can be instrumental in realizing the full potential of macroelectronics. Direct deposition or solid-phase crystallization techniques are often incompatible with polymers and produce materials with high defect densities. Excimer-laser annealing is capable of producing films of reasonable quality directly on polymer and metallic substrates. Sequential lateral solidification (SLS) is an advanced pulsed-laser-crystallization technique capable of producing Si films on polymers with lower defect density than can be obtained via excimer-laser annealing. Circuits built directly on polymers using these SLS films show the highest performance reported to date.

A new class of nanocomposite network materials based on carbon nanotubes or silicon nanowires for thin-film transistors promises significant improvement in the performance of large-area electronics, or macroelectronics. Evaluation of this novel materials technology requires the development of device models. A multicomponent heterogeneous stick-percolation theory is used to show that the key features of this new transistor technology are the consequences of the percolating spatial geometry of the nanosticks (nanotubes, nanorods, or nanowires) that form the channel.

Developments originally targeted toward economical manufacturing of telecommunications products have planted the seeds for new opportunities such as low-cost, large-area electronics based on printing technologies. Organic-based materials systems for printed wiring board (PWB) construction have opened up unique opportunities for materials research in the fabrication of modular electronic systems.

The realization of successful consumer products has been driven by materials developments that expand PWB functionality through embedded passive components, novel MEMS structures (e.g., meso-MEMS, in which the PWB-based structures are at the milliscale instead of the microscale), and microfluidics within the PWB. Furthermore, materials research is opening up a new world of printed electronics technology, where active devices are being realized through the convergence of printing technologies and microelectronics.

The following article is an edited transcript based on the Von Hippel Award presentation by Robert Langer of the Massachusetts Institute of Technology on November 30, 2005, at the Materials Research Society Fall Meeting in Boston. Langer was honored with MRS's highest award for his “pioneering accomplishments in the science and application of biomaterials in drug delivery and tissue engineering, particularly in inventing the use of materials for protein and DNA delivery, and for his achievements in interdisciplinary research which have generated new medical products, created new fields of biomaterials science, and inspired research programs throughout the world.”