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Characterization of Polysiloxane Modified Polysilsesquioxane Films for Low Dielectric Applications: Microstructure, Electrical Properties and Mechanical Properties

Published online by Cambridge University Press:  01 February 2011

Jingyu Hyeon-Lee ,
Yi Yeol Lyu ,
Sang Kook Mah ,
Jin-Hyeong Yim ,
Hyun-Dam Jeong ,
Mong Sup Lee  and
Sang Youl Kim
Jingyu Hyeon-Lee
Affiliation:
E-Polymer Laboratory, Samsung Advanced Institute of Technology, Suwon, 440-600, Korea
Yi Yeol Lyu
Affiliation:
E-Polymer Laboratory, Samsung Advanced Institute of Technology, Suwon, 440-600, Korea
Sang Kook Mah
Affiliation:
E-Polymer Laboratory, Samsung Advanced Institute of Technology, Suwon, 440-600, Korea
Jin-Hyeong Yim
Affiliation:
E-Polymer Laboratory, Samsung Advanced Institute of Technology, Suwon, 440-600, Korea
Hyun-Dam Jeong
Affiliation:
E-Polymer Laboratory, Samsung Advanced Institute of Technology, Suwon, 440-600, Korea
Mong Sup Lee
Affiliation:
Dept of Chemistry, Korea Advanced Institute of Science and Technology, Taejon, 305-701, Korea
Sang Youl Kim
Affiliation:
Dept of Chemistry, Korea Advanced Institute of Science and Technology, Taejon, 305-701, Korea
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Abstract

Poly(ε-caprolactone) (PCL) / poly(siloxane-silsesquioxane) (PSQ-PSSQ) nanohybrid films were fabricated. The dielectric constant of the film was scaled down from 2.66 to 2.28 when the 30% PCL was added into poly(siloxane-silsesquioxane) matrix. The FE-SEM micrograph of poly(ε-caprolactone) / poly(siloxane-silsesquioxane) (PSQ-PSSQ) nanohybrid film shows nanoporous structure. The modulus and hardness of the film decrease with increasing film thickness. As PCL content increases, modulus and hardness of the films decreases.

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