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Coarse-Grained Molecular Dynamics Simulation of Epoxy-Based Chemically-Amplified Resist for MEMS Application

Published online by Cambridge University Press:  07 February 2012

Hiromasa Yagyu
Affiliation:
R&D Division, Mitsuboshi Belting Ltd., Kobe, Japan
Yoshikazu Hirai
Affiliation:
Department of Micro Engineering, Kyoto University, Kyoto, Japan
Akio Uesugi
Affiliation:
Department of Micro Engineering, Kyoto University, Kyoto, Japan
Yoshihide Makino
Affiliation:
Department of Micro Engineering, Kyoto University, Kyoto, Japan
Koji Sugano
Affiliation:
Department of Micro Engineering, Kyoto University, Kyoto, Japan
Toshiyuki Tsuchiya
Affiliation:
Department of Micro Engineering, Kyoto University, Kyoto, Japan
Osamu Tabata
Affiliation:
Department of Micro Engineering, Kyoto University, Kyoto, Japan
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Abstract

A unique simulation method of epoxy-based chemically-amplified resist by coarse-grained molecular dynamics was proposed. The mechanical properties of an epoxy-based chemically-amplified resists with various cross-linking ratios were simulated using a newly developed coarse-grained molecular dynamics simulation that employs a bead-spring model. Models with the different cross-linking ratios were created in the molecular dynamics calculation step and uniaxial elongation simulations were performed. The results reveal that the simulated elastic modulus of the resist modeled by the bead-spring model with an extended angle bending potential depends on the cross-linking ratio; its dependency exhibits good agreement with that determined by nanoindentation tests.

Type
Research Article
Copyright
Copyright © Materials Research Society 2012

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References

REFERENCES

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Coarse-Grained Molecular Dynamics Simulation of Epoxy-Based Chemically-Amplified Resist for MEMS Application
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