Hostname: page-component-76fb5796d-zzh7m Total loading time: 0 Render date: 2024-04-29T13:27:47.808Z Has data issue: false hasContentIssue false

Effect of Humidity on Charge Profiles and Thermal Properties of 1.7 μM Polyimide Films on Silicon Substrates

Published online by Cambridge University Press:  10 February 2011

P. Bloss
Affiliation:
Polymers Division, Bldg. 224 / Rm. B320, National Institute of Standards and Technology, Gaithersburg, MD 20899, peter.bloss@nist.gov
A. S. De Reggi
Affiliation:
Polymers Division, Bldg. 224 / Rm. B320, National Institute of Standards and Technology, Gaithersburg, MD 20899, peter.bloss@nist.gov
H. Schafer
Affiliation:
HF-NMR Facility, NSR Center, University of Nijmegen, Toernooiveld 1, NL-6525 ED Nijmegen, THE NETHERLANDS
Get access

Abstract

Using an improved version of the thermal pulse (TP) method for determining electric field profiles and thermal parameters, we have obtained for the first time field profiles in 1.7 μm thick polyimide (PI) films spin-coated on Si wafers. As-coated films were found to have an internal field caused by negative charges within 200 nm of the free (pulsed) surface believed due to electrochemical reactions involving water. The change near the pulsed surface was stable up to 200 °C and would not be switched by applied fields of ±1 V/μm. The charge distribution and the thermal parameters were found to be sensitive to humidity

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Bloß, P.;, DeReggi, A.S., Schäfer, H., submitted to Phys. Rev. B.Google Scholar
2 The use of commercial names to identify the materials used in no way implies endorsement or recommendation by NIST.Google Scholar
3 DeReggi, A.S., Guttman, C.M., Mopsik, F.I., Davis, G.T., Broadhurst, M.G., Phys. Rev. Lett. 40, 413 (1978).Google Scholar
4 Ferreira, G.F. Leal, Gerhard-Multhaupt, R., Phys. Rev. B, 42, 7317 (1990).Google Scholar
5 Tikhonov, A.N. and Arsenin, V.Y., Solution of Ill-Posed Problems, John Wiley & Sons, New York, 1977.Google Scholar
6 Honerkamp, J., Weese, J., Continuum Mech. Thermod., 2, 17 (1990).Google Scholar
7 Weese, J., Comput Phys. Commun. 69, 99 (1992).Google Scholar
8 8 Information sheet supplied by DuPont with KaptonT foils.Google Scholar
9 Bloß, P., DeReggi, A.S., Davis, G.T., Abstract Book of the IMAPSAdvanced Technology Workshop, Hilton Head Island, SC, June, 1997.Google Scholar
10 Eberle, G., Schmidt, H., Eisenmenger, W., IEEE Trans. Dielectr. Electr. Insul., 3, 624 (1996).Google Scholar