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Exploration of Ternary Subsystems of Superalloys by High-Throughput Thin Film Experimentation: Optical and Electrical Data of the Co-Al-W System

Published online by Cambridge University Press:  04 February 2015

Dennis Naujoks
Institut für Werkstoffe, Ruhr-Universität Bochum, 44780 Bochum, Germany
Dennis Koenig
Institut für Werkstoffe, Ruhr-Universität Bochum, 44780 Bochum, Germany
Alfred Ludwig
Institut für Werkstoffe, Ruhr-Universität Bochum, 44780 Bochum, Germany
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The complete ternary system Co-Al-W was fabricated as a thin film materials library by combinatorial magnetron sputtering. The materials library was investigated using high-throughput characterization methods such as optical measurements as well as automated resistance screening. The obtained data indicate possible phase regions and compositional regions which show early surface oxidation. The demonstrated approach illustrates that using high-throughput measurement methods provides a fast access to data of relatively unexplored materials systems. The gained data provides a valuable basis for further in-depth studies of the investigated materials systems.

Copyright © Materials Research Society 2015 

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Ludwig, A., Zarnetta, R., Hamann, S., Savan, A., Thienhaus, S.: Development of multifunctional thin films using high-throughput experimentation methods, International Journal of Materials Research, Vol. 99, No. 10, pp. 11441149, (2008)Google Scholar
Hamann, S., Savan, A., Thienhaus, S., Ludwig, A.: Combinatorial Development of Fe-Pd-Mn Ferromagnetic Shape Memory Thin Films, ACTUATOR (2008)Google Scholar
Sato, J., Omori, T., Oikawa, K., Ohnuma, I., Kainuma, R., Ishida, K.: Cobalt-Base High-Temperature Alloys, Science Vol. 312 no. 5770 pp. 90-91, (2006)Google ScholarPubMed
Thienhaus, S., Hamann, S., Ludwig, A.: Modular high-throughput test-stand for versatile screening of thin-film materials libraries. Sci. Technol. Adv. Mater. 2011, 12, No. 054206Google ScholarPubMed
Janghorban, A., Pfetzing-Micklich, J., Frenzel, J., Ludwig, A.: Investigation of the Thin-Film Phase Diagram of the Cr–Ni–Re System by High-Throughput Experimentation, Adv. Eng. Mat., 16, No. 5, (2014)Google Scholar
Spaepen, F.: Interfaces and Stress in thin films, Acta mater. 48, 31, (2000)Google Scholar
Thornton, John A., Hoffman, D.W.: Stress-related effects in thin films, Thin Solid Films, Volume 171, Issue 1, 1 April 1989, Pages 531 CrossRefGoogle Scholar
Honig, R.E., Vapor pressure data for solid and liquid elements, RCA Review, 23: 567586. (1962)Google Scholar
Chapman, B. N.: Thin-film adhesion, Journal of Vacuum Science & Technology 11, 106, (1974)Google Scholar
Pollock, D.D.: Electrical Conduction In Solids: An Introduction, American Society for Metals, Metals-Park, OH (1985)Google Scholar
Thienhaus, S., Naujoks, D., Pfetzing-Micklich, J., König, D., Ludwig, A.: Rapid identification of areas of interest in thin film materials libraries by combining electrical, optical, X-ray diffraction and mechanical high-throughput measurements: a case study for the system Ni-Al, ACS Comb Sci., 16, 686–94, (2014)Google ScholarPubMed