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Low-Temperature Photosensitive Polyimide Processing for Use in 3D Integration Technologies

Published online by Cambridge University Press:  03 June 2014

Frank Windrich ,
Mikhail Malanin ,
Klaus J. Eichhorn ,
Brigitte Voit  and
Klaus D. Lang
Frank Windrich
Affiliation:
Center “All Silicon System Integration Dresden”, Fraunhofer IZM, Moritzburg, Germany Organic Chemistry of Polymers, Technische Universität Dresden, Dresden, Germany
Mikhail Malanin
Affiliation:
Leibniz-Institut für Polymerforschung Dresden e.V., Dresden, Germany
Klaus J. Eichhorn
Affiliation:
Leibniz-Institut für Polymerforschung Dresden e.V., Dresden, Germany
Brigitte Voit
Affiliation:
Leibniz-Institut für Polymerforschung Dresden e.V., Dresden, Germany Organic Chemistry of Polymers, Technische Universität Dresden, Dresden, Germany
Klaus D. Lang
Affiliation:
Center “All Silicon System Integration Dresden”, Fraunhofer IZM, Moritzburg, Germany
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Keywords

polymerkineticsmicroelectronics

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References

REFERENCES

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