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Mechanical Parameter Extraction Using Resonant Structures

Published online by Cambridge University Press:  15 February 2011

J. Elders ,
H.A.C. Tilmans ,
S. Bouwstra  and
M. Elwenspoek
J. Elders
Affiliation:
MESA Research Institute, University of Twente, P.O. Box 217, 7500 AE Enschede, The Netherlands
H.A.C. Tilmans
Affiliation:
MESA Research Institute, University of Twente, P.O. Box 217, 7500 AE Enschede, The Netherlands
S. Bouwstra
Affiliation:
Mikroelektronik Centret, Building 345 east, DK-2800 Lyngby, Denmark
M. Elwenspoek
Affiliation:
MESA Research Institute, University of Twente, P.O. Box 217, 7500 AE Enschede, The Netherlands
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Abstract

In order to model and design micromechanical sensors and actuators, it is of crucial importance that thin film mechanical parameters, such as the Young's modulus and the residual stress, are known. In this paper, the parameter extraction method using resonant structures has been used to obtain these data and has been compared with the bulge test. Circular aluminum diaphragms have been used as samples.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 171
Copyright
Copyright © Materials Research Society 1993

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References

REFERENCES

1 Maden, M.A., Tong, K. and Farris, R.J. in Thin Films: Stresses and Mechanical Properties II, edited by Doerner, M.F., Oliver, W.C., Pharr, G.M. and Brotzen, F.R. (Mater. Res. Soc. Proc. 188, San Francisco, Ca, 1990) pp. 29–34.Google Scholar
2 Jagota, A., Mazur, S. and Farris, R J. in Thin Films: Stresses and Mechanical Properties II. edited by Doerner, M.F., Oliver, W.C., Pharr, G.M. and Brotzen, F.R. (Mater. Res. Soc. Proc. 188, San Francisco, Ca, 1990) pp. 35 Google Scholar
3 Wan, T., the Journal of the Acoustical Society of America, 34, 3, 275 (1962).Google Scholar
4 Tilmans, H.A.C., Elwenspoek, M. and Fluitman, J.H.J., Sensors and Actuators A, 30, 35–53 (1992).Google Scholar
5 Lammerink, T.S J., PhD thesis, University of Twente, 1990.Google Scholar
6 Small, M.K., Vlassak, J J. and Nix, W.D. in Thin Films: Stresses and Mechanical Properties III, edited by Nix, W.D., Bravman, J.C., Arzt, E. and Freund, L.B. (Mater. Res. Soc. Proc. 239, Boston, 1991) pp. 257–262.Google Scholar