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A new method of manufacturing high aspect ratio structures using SU8 negative photoresist

Published online by Cambridge University Press:  01 February 2011

Saydulla Persheyev  and
Mervyn John Rose
Saydulla Persheyev
Affiliation:
s.persheyev@dundee.ac.ukpersaydundee@gmail.com
Mervyn John Rose
Affiliation:
m.j.rose@dundee.ac.uk, University of Dundee, Electronics Engineering and Pysics, Dundee, United Kingdom
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Abstract

SU8 Negative photoresist is finding high demand in applications such as MEMS sensors and waveguides. The possibility of photolithographic patterning and high physical and dielectric properties are attracting ever more users among workers in the electronics industry and increasingly in biomedical applications. In our work we employ an original method of exposing of SU8 and create high aspect ratio structures on glass and other substrates. Dry plasma etching results of negative epoxy-based photoresist by Inductively Coupled Plasma system using gases O2 and CF4 are presented.

Keywords

biomateriallithography (deposition)microelectro-mechanical (MEMS)

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References

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