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Polyimides and Copolyimides with Low Dielectric Constant, Low Moisture Absorption, and Low Coefficient of Thermal Expansion for use as Interlayer Dielectrics

Published online by Cambridge University Press:  25 February 2011

Brian C. Auman
Brian C. Auman*
Affiliation:
DuPont Company, Electronic Materials, Experimental Station, E336/205, Wilmington, DE 19880
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Abstract

The mechanical, thermal, electrical and moisture absorption properties of a series of fluorinated, highly rod-like polyimides and copolyimides are reported. Copolymerization with appropriate flexibilizing comonomers resulted in improved elongations versus those of the highly rod-like homopolymers while maintaining, to a large extent,the other desirable properties of the backbone. These materials are considered prime candidates for interlayer dielectric due to their excellent combination of properties.

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References

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