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Adhesion Strength of Cu/Polyimide Measured by Continuous Micro-Wedge Scratch Test

Published online by Cambridge University Press:  21 February 2011

F. Wang ,
J.C. Nelson ,
H. Huang ,
M. de Boer ,
W.W. Gerberich  and
R.L. Swisher
F. Wang
Affiliation:
Department of Chemical Engineering and materials Science, University of Minnesota, MPLS, MN 55455
H. Huang
Affiliation:
Department of Chemical Engineering and materials Science, University of Minnesota, MPLS, MN 55455
M. de Boer
Affiliation:
Department of Chemical Engineering and materials Science, University of Minnesota, MPLS, MN 55455
W.W. Gerberich
Affiliation:
Department of Chemical Engineering and materials Science, University of Minnesota, MPLS, MN 55455
R.L. Swisher
Affiliation:
Sheldahl Inc., Northfield, MN 55057-0170
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Abstract

A modified form of nanoscratch test, continuous micro-wedge scratch technique was applied to characterize the adhesion strength of 0.2 μm thick, 10 μm width sputtered copper fine lines on 50 μm thick solid PMDA-ODA polyimide films. A 20 μm width wedge-shaped diamond tip was used to mechanically debond Cu fine lines to polyimide substrate. Using a microindenter under control depth testing mode, critical loads for delaminations were obtained. The scratch morphology and the debonded areas were observed by scanning electron microscopy. The scratch test results by conical-shaped tip on plain films are also presented here and are compared to the results by wedge-shaped tip in fine metal lines. Practical work of adhesion of 4.1 J/m2 was calculated by FEM based on bimaterial fracture mechanism

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 318: Symposium Ca – Interface Control of Electrical, Chemical, and Mechanical Properties , 1993 , 323
Copyright
Copyright © Materials Research Society 1994

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References

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