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Adhesive Bonding Via Exposure to Variable Frequency Microwave Radiation

  • Felix L. Paulauskas (a1), April D. McMillan (a1) and C. David Warren (a1)

Abstract

Adhesive bonding through the application of variable frequency microwave (VFM) radiation has been evaluated as an alternative curing method for joining composite materials. The studies showed that the required cure time of a thermosetting epoxy adhesive is substantially reduced by the use of VFM when compared to conventional (thermal) curing methods. Variable frequency microwave processing appeared to yield a slight reduction in the required adhesive cure time when compared to processing by the application of single frequency microwave radiation. In contrast to the single frequency processing, the variable frequency methodology does not readily produce localized overheating (burnt or brown spots) in the adhesive or the composite. This makes handling and location of the sample in the microwave oven less critical for producing high quality bonds and allows for a more homogeneous distribution of the cure energy. Variable frequency microwave processing is a valuable alternative method for rapidly curing thermoset adhesives at low input power levels.

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References

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1. Office of Transportation Materials, Materials for Lightweight Vehicles Program Plan, United States Department of Energy, (1992).
2. Surrett, A.D., Lauf, R.J., Paulauskas, F.L. and Johnson, A.C., MRS Symposium Proceedings, 347, 691 (1994).
3. Johnson, A.C., Lauf, R.J. and Surrett, A.D., MRS Symposium Proceedings, 347, 453 (1994).
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6. Paulauskas, F.L., Meek, T.T. and Warren, C.D., SAMPE International Technical Conference Proceedings, 27, 114 (1995).
7. Warren, C.D., Boeman, R.G. and Paulauskas, F.L., 1994 DOE Contractors Coordination Meeting Conference Proceedings, 2, 1 (1994).
8. Boeman, R.G. and Warren, C.D., 10th Annual ASM/ESD Advanced Composites Conference Proceedings, 473 (1995).
9. Paulauskas, F.L., Meek, T.T. and Warren, C.D., MRS Symposium Proceedings, 430 (1996) In press in this proceeding.
10. Paulauskas, F.L. and Meek, T.T., MRS Symposium Proceedings, 347, 743 (1994).
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  • EISSN: 1946-4274
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