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Advanced Alkali Cleaning Solution for Simplification of Semiconductor Cleaning Process

  • Hitoshi Morinaga (a1) (a2), Masumi Aoki (a1), Toshiaki Maeda (a1) and Masaya Fujisue (a1)

NH4OH/H2O2/H2O (called APM or SC–1) cleaning combined with megasonic irradiation is found to feature outstanding removal efficiency for various types of particulate contaminant. The conventional APM cleaning, however, allows metallic impurity in solution to adhere onto substrate surface, and it must be followed by acid cleaning such as HCI/IH2O2/H2O (called HPM or SC–2) cleaning to remove metallic impurity from substrate. The advanced APM cleaning using MC–1 which is alkali cleaning agent containing chelating agent has been developed, and this new cleaning is found capable for preventing various metallic impurities including Al in solution from contaminating substrate surface. Besides, with cleaning conditions optimized, the advanced APM cleaning using MC–1 can also remove metallic impurity from substrate surface. In short, this modified APM cleaning is capable for removing particle and metallic impurity at the same time, which is not possible with the conventional cleaning technology. The cleaning process of semiconductor manufacturing process can be simplified if HPM cleaning is eliminated by introducing the advanced APM cleaning using MC–1. This leads to drastic reduction of cleaning cost and improvement of throughput of the cleaning process.

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1. Kern W. and Puotinen D.A., RCA Rev., Vol.31, pp.187205, June, (1970).
2. Morinaga H., Suyama M. Nose M., Verhaverbeke S., and Ohmi T., IEICE Trans. Electron., Vol.E79–C, No.3, pp.343362, Japan, March, (1996).
3. Morinaga H., Fujisue M., Aoki M., Maeda T., Tanaka H., and Toyoda M., in Proceedings of 27th Symposium on ULSI Ultra Clean Technology, pp.7584, Ultra Clean Society, Tokyo, March, (1996).
4. Morinaga H., Aoki M., Maeda T., Fujisue M., Tanaka H., and Toyoda M., in Proceedings of 16th Annual Semiconductor Pure Water and Chemical Conference, Vol.2, pp.109130, Santa Clara, March, (1997).
5. Morinaga H. and Ohmi T., in Proceedings of The Fourth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing., Edited by Novak R.E. and Ruzyllo J., pp.257268, The Electrochemical Society, Inc., Pennington, NJ, (1996).
6. Cohen S.L., Syverson W., Basilier S., Fleming M.J., Furman B., Gow C., Pope K., Tsai R., and Liehr M., in Proceedings of the Second International Symposium on Ultra-clean Processing of Silicon Surfaces, pp.3539, Acco Leuven, Belgium, (1994).
7. ltano M., Kern F.W., Jr., Miyashita M., and Ohmi T., IEEE Trans. Semicond. Manufact., Vol.6, No.3, pp.258267, (1993).
8. Hiratsuka H., Tanaka M., Tada T., Yoshimura R., and Matsushita Y., Ultra Clean Technology, Vol.3, No.3, pp.1827, Ultra Clean Society, Tokyo, (1991).
9. Mori Y., Uemura K., Shimanoe K., and Sakon T., J. Electrochem. Soc., Vol.142, No.9, pp.31043109, September, (1995).
10. Ohtsuka S., Sakon T., Atsumi J., Japanese patent, (JP) 1-289937, (1989).
11. Verhaverbeke S., Meuris M., Mertens P.W., Heyns M.M., Philipossian A., Graf D., and Schnegg A., Tech. Dig. IEDM '91, pp.71–74, (1991).
12. Takiyama M., Ohtsuka S., Hayashi S., Tachimori M., in Proceedings of 19th Workshop on ULSI Ultra Clean Technology, pp.95107, Tokyo, September, (1992).
13. Akiya H., Kuwano S., Matsumoto T., Itsumi H., and Yabumoto N., J. Electrochem. Soc., Vol.141, No.10, pp.L139–L142, October, (1994).
14. Roche T., Adler S., Cosway R., Schauer S., and Liu Lisa, in Proceedings of The Fourth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing., Edited by Novak R.E. and Ruzyllo J., pp.257268, The Electrochemical Society, Inc., Pennington, NJ, (1996).
15. Tsuji M., Muramatsu M., and Aoto N., Extended Abstracts of 188th Electrochemical Society meetings, pp.752753, Chicago, October, (1995).
16. Shimono T. and Tsuji M., Extended Abstracts of Electrochemical Society meetings, Vol.91–1, pp.278279, Washington, DC, May, (1991).
17. deLarios J.M., Kao D.B., Deal B.E., and Helms C.R., J. Electrochem. Soc., Vol.138, No.8, pp.23532361, August, (1991).
18. Ringbom A., “Complexation in analytical chemistry,” John Wiley and Sons Inc., New York, (1963).
19. Sako N., Tanaka H., Toyoda M., Naka J., and Kuramoto K., Bunseki Kagaku (Japanese Journal), Vol.43, pp.771776, (1994).
20. Morinaga H., Suyama M., Yonekawa N., Nose M., and Ohmi T., International Conference on Advanced Microelectronics Devices and Processing, pp.397402, Sendai, March, (1994).
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