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Analysis of Crystalline in GaN Epitaxial Layer after the Wafer Dicing Process

Published online by Cambridge University Press:  15 January 2014

Hideyuki Taguchi
Affiliation:
Physical Analysis & Evaluation Center, Electronics Division, KOBELCO RESEARCH INSTITUTE, INC., 1-5-5, Takatsukadai, Nishi-ku, Kobe, 651-2271, JAPAN Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University, 2-1, Yamadaoka, Suita, Osaka, 565-0871, JAPAN
Amane Kitahara
Affiliation:
Physical Analysis & Evaluation Center, Electronics Division, KOBELCO RESEARCH INSTITUTE, INC., 1-5-5, Takatsukadai, Nishi-ku, Kobe, 651-2271, JAPAN
Shugo Miyake
Affiliation:
Physical Analysis & Evaluation Center, Electronics Division, KOBELCO RESEARCH INSTITUTE, INC., 1-5-5, Takatsukadai, Nishi-ku, Kobe, 651-2271, JAPAN
Akimitu Nakaue
Affiliation:
Physical Analysis & Evaluation Center, Electronics Division, KOBELCO RESEARCH INSTITUTE, INC., 1-5-5, Takatsukadai, Nishi-ku, Kobe, 651-2271, JAPAN
Yasufumi Fujiwara
Affiliation:
Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University, 2-1, Yamadaoka, Suita, Osaka, 565-0871, JAPAN
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Abstract

The crystallinity of a GaN epitaxial layer on a sapphire substrate after the mechanical ding process was estimated by transmission electron microscopy (TEM) and Raman spectroscopic analysis. TEM observation results showed that, the screw dislocations as a threading dislocation were induced by the mechanical dicing process in the limited area up to approximately 1.2 μm from the dicing-line. On the other hand, the crystal strains were up to approximately 7 μm from the dicing-line edge measured by the Raman spectroscopic analysis. The distance difference between the area of the screw dislocations and of the residual strain is caused by the stress relaxation.

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Articles
Copyright
Copyright © Materials Research Society 2013 

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References

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