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Analysis of the Mechanical Failure in a Multilayered Thin Film System Tested by Microtensile Loading

Published online by Cambridge University Press:  15 February 2011

T. Marieb ,
M. Ignat ,
H. Fujimoto  and
P. Flinn
T. Marieb
Affiliation:
Intel Corporation, 3065 Bowers Ave., Santa Clara, CA 95052
M. Ignat
Affiliation:
INP Grenoble, LTPCM ENSEEG, St. Martin D'Heres, France
H. Fujimoto
Affiliation:
Intel Corporation, 3065 Bowers Ave., Santa Clara, CA 95052
P. Flinn
Affiliation:
Intel Corporation, 3065 Bowers Ave., Santa Clara, CA 95052
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Abstract

Multilayered thin films were deposited on pure Al substrate test bars for in situ scanning electron microscope (SEM) microtensile deformation. The films consisted of a TiN layer covered by either SiO2 or W. Deformation of the samples showed that the TiN film dominated cracking events and caused cracking in the W to occur at lower critical stress values than previously reported. Crack deflections along the TiN-W interface were also seen. W film strain was measured by X-ray diffraction before and after testing to look at the effect of cracking and deformation on stress in this film.

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Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 391: Symposium T – Materials Reliability in Microelectronics V , 1995 , 85
Copyright
Copyright © Materials Research Society 1995

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References

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