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Application of Tem on Sub-Half Micron Semiconductor Devices

Published online by Cambridge University Press:  10 February 2011

Hong Zhang
Hong Zhang*
Affiliation:
PVD Technology, Applied Materials, 4250 Burton Dr. Santa Clara, CA 95054
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Abstract

Application of transmission electron microscopy on sub-half micron devices has been illustrated in terms of process evaluation and failure analysis. For process evaluation, it is emphasized that a large number of features need to be examined in order to have reliable conclusions about the processes, while for failure analysis, the goal is to pin-point a single process step causing failure or a single source introducing the particle defect.

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References

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