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Area-Selective Laser Processing Techniques for Multichip Interconnect

Published online by Cambridge University Press:  21 February 2011

Y.S. Liu  and
H. S. Cole
Y.S. Liu
Affiliation:
GE Research and Development Center; P.O. Box 8, Schenectady, New York, 12305
H. S. Cole
Affiliation:
GE Research and Development Center; P.O. Box 8, Schenectady, New York, 12305
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Abstract

The interest in laser processing technology has increased significantly in recent years because of increasing demands for application-specific IC design and fabrication, yield enhancement, circuit restructuring, and prototyping; all of these benefit from an adaptive processing technique using direct energy for improvement of precision, resolution, process automation, and turnaround time. This paper reviews several laser-patterned metallization techniques developed for high-density multichip interconnection applications. Key material and process requirements for developing a viable laser-direct-write interconnect technique on polyimide are addressed.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989 , 11
Copyright
Copyright © Materials Research Society 1989

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