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As and B Ion Implantation Through Mo and into Mo-Silicide Layers for Shallow Junction Formation

Published online by Cambridge University Press:  25 February 2011

R. Angelucci ,
M. Merli ,
S. Solmi ,
A. Armigliato ,
E. Gabilli ,
D. Govoni  and
A. Poggi
R. Angelucci
Affiliation:
CNR — Istituto LAMEL, Via Castagnoli 1, 40126 Bologna, Italy
M. Merli
Affiliation:
CNR — Istituto LAMEL, Via Castagnoli 1, 40126 Bologna, Italy
S. Solmi
Affiliation:
CNR — Istituto LAMEL, Via Castagnoli 1, 40126 Bologna, Italy
A. Armigliato
Affiliation:
CNR — Istituto LAMEL, Via Castagnoli 1, 40126 Bologna, Italy
E. Gabilli
Affiliation:
CNR — Istituto LAMEL, Via Castagnoli 1, 40126 Bologna, Italy
D. Govoni
Affiliation:
CNR — Istituto LAMEL, Via Castagnoli 1, 40126 Bologna, Italy
A. Poggi
Affiliation:
CNR — Istituto LAMEL, Via Castagnoli 1, 40126 Bologna, Italy
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Abstract

Good quality p+/n and n+/p shallow junctions (< 0.15 um) with reverse current density of few nA/cm2 and low contact resistivity (∼ 5×10–7 Ω cm2) have been fabricated by using Mo suicide and Rapid Thermal Annealing (RTA). The processes of implantation through Mo films and into MoSi2 layers have been comparatively analysed on the basis of SIMS and carrier concentration profiles, TEM observations and DLTS measurements. In the case of n+/p diodes fabricated by ITM technology slightly worse leakage currents have been observed, in spite of the better planarity of the silicide-silicon interface exhibited by these structures.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 157: Symposium A – Beam-Solid Interactions: Physical Phenomena , 1989 , 751
Copyright
Copyright © Materials Research Society 1990

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References

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