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Assessment of Carbon Contamination in Titanium Nitride Films Deposited from the Reaction of Titanium (IV) Ciiloride and Amines

Published online by Cambridge University Press:  22 February 2011

Keith B. Williams
Affiliation:
Department of Chemistry, Wayne State University, Detroit, MI 48202
Ogie Stewart
Affiliation:
Department of Chemistry, Wayne State University, Detroit, MI 48202
Gene P. Reck
Affiliation:
Department of Chemistry, Wayne State University, Detroit, MI 48202
James W. Proscia
Affiliation:
Ford Motor Company, Glass Division, Dearborn, MI 48120
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Abstract

The reaction of titanium (IV) chloride and amines in an atmospheric pressure chemical vapor deposition (APCVD) has been previously shown to produce high quality titanium nitride films. These films were gold in appearance with high infrared reflectivity and resistivities as low as 80 microhm-cm. In the present study, the carbon content of the amines was systematically increased and the carbon levels in the films measured by XPS. For primary amines carbon contamination was not detected. Films deposited from secondary and tertiary amines had measurable carbon contamination. Correlation of carbon contamination with electrical resistivity and infrared reflectivity is discussed. Scanning electron micrographs and x-ray diffraction of the films are presented.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

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References

1. Scintlmeister, W., Pacher, O., and Pfaffinger, K., I. Electrochem. Soc. 123, 924 (1976).Google Scholar
2. Kurtz, R. S., and Gordon, R. G., Thin Solid Films, 140, 277 (1986).Google Scholar
3. Fix, R. M., Gordon, R. G., and Hoffman, D. M., J. Am. Chem. Soc., 112, 7833 (1990).Google Scholar
4. Buiting, M. J., Otterloo, A. F., and Montree, A. H., J. Electrochem. Soc. 138, 500 (1992).Google Scholar
5. Yokoyama, N., Hinode, K., and Homma, Y., J. Electrochem. Soc. 138, 190 (1991).Google Scholar
6. Proscia, J., Williams, K. B., and Reck, G., Abstract of Papers, Fourth Chemical Congress of North America, New York; American Chemical Society: Washington, DC; INOR 309 (1991).Google Scholar
7. Reedy, C. D., U.S. Patent # 3,656,995 (1972).Google Scholar
8. Karlsson, B., Shimshock, R. P., Seraphin, B. O., and Haygarth, J. C., Physica Scripta, 25, 775 (1982).Google Scholar
9. Roux, L., Hanus, J., Francois, J. C., and Sigrist, M., Sol. Ener. Mat. 7, 299 (1982)Google Scholar
10. Cowdell, R. T. and Fowles, G. A. W., J. Chem. Soc., 2522 (1960).Google Scholar
11 Winter, C. H., Sheridan, P. H., Lewkebandara, T. S., Heeg, M. J., and Proscia, J., Am. Chem. Soc. 114, 1095 (1992).Google Scholar