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Characterization and Control of Copper CMP with Optoacoustic Metrology

Published online by Cambridge University Press:  18 March 2011

Michael Gostein ,
Paul Lefevre ,
Alex A. Maznev  and
Michael Joffe
Michael Gostein
Affiliation:
International SEMATECH, 2706 Montopolis Drive, Austin, TX 78741, U.S.A.
Paul Lefevre
Affiliation:
Philips Analytical 12 Michigan Drive, Natick, MA 01760, U.S.A.
Alex A. Maznev
Affiliation:
International SEMATECH, 2706 Montopolis Drive, Austin, TX 78741, U.S.A.
Michael Joffe
Affiliation:
International SEMATECH, 2706 Montopolis Drive, Austin, TX 78741, U.S.A.
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Abstract

We discuss applications of optoacoustic film thickness metrology for characterization of copper chemical-mechanical polishing (CMP). We highlight areas where the use of optoacoustics for CMP characterization provides data complementary to that obtained by other techniques because of its ability to directly measure film thickness with high spatial resolution in a rapid, non-destructive manner. Examples considered include determination of planarization length, measurement of film thickness at intermediate stages of polish, and measurement of arrays of metal lines.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 671: Symposium M – Chemical-Mechanical Polishing 2001–Advances and Future Challenges , 2001 , M3.9
Copyright
Copyright © Materials Research Society 2001

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References

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