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Characterization of Defects in CZ-grown Si Crystals with OSF Ring

Published online by Cambridge University Press:  03 September 2012

Satoshi Ogushi
Affiliation:
Kyushu Electronic Metal Corporation, Semiconductor Research Laboratory, 2201 Kouhoku, Kishima, Saga 849–05
Masataka Hourai
Affiliation:
Kyushu Electronic Metal Corporation, Semiconductor Research Laboratory, 2201 Kouhoku, Kishima, Saga 849–05
Tatuhiko Shigematsu
Affiliation:
Kyushu Electronic Metal Corporation, Semiconductor Research Laboratory, 2201 Kouhoku, Kishima, Saga 849–05
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Abstract

The nature and radial distribution of crystallographic micro-defects in CZ-grown silicon crystal wafers which exhibit OSF ring were investigated. With the difference in copper decoration XRT image and in temperature dependence of oxgen precipitation, four coaxial ring regions were clearly identified. In the OSF ring region, oxgen precipitation takes place even at relatively high temperatures around 1, 100°C. Gold diffusion experiments were also carried out, for which the ‘kick-out mechanism’ was considered to reveal the density distribution of sinks for interstitial silicon. A semi-quantitative schematic model describing the density distribution of the precipitation nuclei as a function of critical size of the nuclei for each of the four ring regions is derived. The nuclei that are stable at high temperature act as sinks for interstitial silicon atoms, generating stacking faults.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

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References

5. REFERENCES

[1] Hasebe, M., Takeoka, Y., Shinoyama, S. and Naito, S.: Proc. Int. Conf. Sci. and Tech. Defect Control in Semicond. Yokohama, Vol. 1, 157 (1986) (North-Holl and, 1990, ed. Sumino, K.)Google Scholar
[2] Tachimori, H., Sakon, T. & Kaneko, T.; 7th Kesho Kohgaku Symposium of Japan Soc. of Appl. Phys., JSAP Catalog No: AP902217 (1990)Google Scholar
[3] Abe, T.: OYO BUTURI, 59, 272 (1990)Google Scholar
[4] Wijaranakvla, W.: J. Electrochem. Soc, 139, No. 2, 604 (1992)Google Scholar
[5] Harada, H., Abe, T.: Proceeding of the 5th Intern. Symp. on Silicon Materials Sci. and Tech. Semiconductor Silicon, 76, (1986)Google Scholar
[6] Frank, W., Gösele, U., Seeger, A.: Inst. Phys. Conf. Ser. 46, 514 (1979)Google Scholar
[7] Frank, F. C. and Turnbull, D.: Phys. Rev. 104, 617 (1956)Google Scholar
[8] Gösele, U., Frank, W. and Seeger, A.: J. Appl. Phys. 23, 361 (1980)CrossRefGoogle Scholar
[9] Bullis, W. M.: Solid-State Electron. 9, 143 (1966)Google Scholar
[10] Stolwijk, N. A., Schoster, B., and Hölzl, J.: Appl. Phys. a33, 133 (1984)CrossRefGoogle Scholar
[11] Philips, V. A. and Dash, W. C.: J. Appl. Phys. 33, 568 (1962)CrossRefGoogle Scholar