Hostname: page-component-8448b6f56d-c47g7 Total loading time: 0 Render date: 2024-04-24T16:24:31.718Z Has data issue: false hasContentIssue false

Characterization of Tetrahedrally Bonded Amorphous Carbon Via Capacitance Techniques

Published online by Cambridge University Press:  10 February 2011

Kimon C. Palinginis
Affiliation:
Department of Physics, University of Oregon, Eugene, OR 97403, U.S.A.
A. Ilie
Affiliation:
Engineering Department, University of Cambridge CB2 1PZ, U.K.
B. Kleinsorge
Affiliation:
Engineering Department, University of Cambridge CB2 1PZ, U.K.
W.I. Milne
Affiliation:
Engineering Department, University of Cambridge CB2 1PZ, U.K.
J. D. Cohen
Affiliation:
Department of Physics, University of Oregon, Eugene, OR 97403, U.S.A.
Get access

Abstract

We report the results of junction capacitance measurements on thin tetrahedral amorphous carbon (ta-C) films to deduce their defect densities. We find defect densities in the range 3 - 7 × 1017 cm−3 in the undoped ta-C films, and roughly an order of magnitude larger in the nitrogen doped (n-type) films. In some cases fairly uniform defect profiles were obtained covering a thickness of a couple of hundreds angstroems. We also observed a thermal activation process of carriers from defect states at the ta-C/c-Si interface with an activation energy in the range of 0.4eV to 0.5eV.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Fallon, P.J., Veerasamy, V.S., Davis, C.A., Robertson, J., Amaratunga, G.A.J., Milne, W.I., and Koskinen, J., Phys. Rev. B 48, 4777 (1993)Google Scholar
[2] Satyanarayana, B.S., Hart, A., Milne, W.I., Robertson, J., Appl. Phys. Lett. 71, 1430 (1997) and references therein.Google Scholar
[3] Chhowalla, M., Robertson, J., Chen, C.W., Silva, S., Davis, C.A., Amaratunga, G., Milne, W.I., J. Appl. Phys. 81, 139 (1997)Google Scholar
[4] Veerasamy, V.S., Amaratunga, G.A.J., Davis, C.A., Milne, W.I. and Hewitt, P., Solid-St. Electron. 36, 345 (1993)Google Scholar
[5] Robertson, J. and Davis, C.A., Diamond Relat. Mater., 4 (1995) 441 Google Scholar
[6] Essick, J.M. and Cohen, J.D., Appl. Phys. Lett. 55, 1232 (1989)Google Scholar
[7] Matsuura, H., J. Appl. Phys. 64, 1964 (1988)Google Scholar
[8] Cohen, J.D. in Semiconductors and Semimetals, Vol.21, Part C edited by Pankove, J., (Academic Press, New York, 1984), p. 996 Google Scholar
[9] Sze, S.M. in Physics of Semiconductor Devices 1st Ed., (John Wiley & Sons, New York, 1969), p. 8496 Google Scholar
[10] Lang, David V., Cohen, J. David, and Harbison, James P., Phys. Rev. B 25, 5285 (1982)Google Scholar
[11] Michelson, C.E., Gelatos, A.V., and Cohen, J.D., Appl. Phys. Lett. 47, 412 (1985)Google Scholar