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A Controlled Method Of Preparing Plan-View Silicon Samples For Transmission Electron Microscopy Studies

Published online by Cambridge University Press:  21 February 2011

Myrtle B. Ellington
Myrtle B. Ellington*
Affiliation:
AT&T Bell Laboratories, Murray Hill, NJ 07974
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Abstract

Transmission electron microscopy (TEM) is an important technique for studies of extended defects and other microstructural features in semiconductor materials. An efficient, plan-view thinning technique is always desirable for these TEM studies. The problems associated with wet chemical thinning of silicon are often surface residues, pitting and rapid breakthrough. A controlled method for obtaining thin, plan-view TEM silicon samples by chemical thinning was developed and the method is described in this paper. Results indicate that the method minimizes the above cited problems and has several other advantages over previously reported thinning methods.

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References

REFERENCES

[1] Clapper, R. A., private communication.Google Scholar
[2] Kern, W., “Chemical Etching of Silicon, Germanium, Gallium Arsenide and Gallium Phosphide”, RCA Review, Vol.39, No. 2, 278–308, June 1978.Google Scholar
[3] See Quick Reference Manual for SIC Technology, edited by Beadle, W. E., Tsai, J. C. C. and Plummer, R. D. (John Wiley & Sons, 1985) pp. 5–1 5–15.Google Scholar
[4] Flood, W. F., private communication.Google Scholar
[5] From Norton Chemplast, 150 Dey Road, Wayne, NJ 07470.Google Scholar
[6] Sheng, T.T., “Cross-Sectional Transmission Electron Microscopy of Electronic and Photonic Devices”, Analytical Techniques for Thin Films, edited by Tu, K. N. and Rosenberg, R. (Academic Press Inc., to be published) pp 252–295.Google Scholar