Hostname: page-component-76fb5796d-qxdb6 Total loading time: 0 Render date: 2024-04-25T17:29:08.831Z Has data issue: false hasContentIssue false
  • English
  • Français

Copper Metallization of Polyimide Film by Excimer Laser Irradiation and Electrodeposition

Published online by Cambridge University Press:  21 February 2011

James L. Hohman ,
Kenneth B. Keating  and
Michael J. Kelley
James L. Hohman
Affiliation:
Central Research & Engineering Laboratories, E.I.du Pont de Nemours & Co. Inc., Wilmington, DE 19880–0304
Kenneth B. Keating
Affiliation:
Central Research & Engineering Laboratories, E.I.du Pont de Nemours & Co. Inc., Wilmington, DE 19880–0304
Michael J. Kelley
Affiliation:
Central Research & Engineering Laboratories, E.I.du Pont de Nemours & Co. Inc., Wilmington, DE 19880–0304
Get access

Abstract

Severe excimer laser irradiation is reported to impart electrical conductivity to Kapton* polymide films. We find that a proper choice of pretreatment and irradiation practice reduces the required dose markedly. Such films have sufficient conductivity to permit direct, good-quality, adherent copper electroplating.H.M.Phillips, D.L.Callahan, R.Sauerbrey, G.Szabo and Z.Bor; Appl.Phys.Lett.58, 2761 (1991).

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 354: Symposium A – Beam Solid Interactions for Materials Synthesis and Characterization , 1994 , 571
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Gittleman, J.L. and Sichel, E.K.; J.Electron.Mat. 10, 527 (1981).Google Scholar
2 Davenas, J.; Appl.Surf.Sci. 36, 539 (1989).Google Scholar
3 Sutcliffe, E. and Srinivasan, R.; J.Appl.Phys. 60, 3325 (1986).Google Scholar
4 Schumann, M., Sauerbrey, R. and Smayling, M.C.; Appl.Phys.Lett. 58, 428 (1991).Google Scholar
5 Phillips, H.M., Callahan, D.L., Le Blanc, S.P., Bali, Z. and Sauerbrey, R.; Mat.Res.Soc.Proc. 285, 169 (1993).Google Scholar
6 Phillips, H.M., Feurer, T., Callahan, D.L. and Sauerbrey, R.; Mat.Res. Soc.Proc. 285, 175 (1993).Google Scholar
7 Feurer, T., Sauerbrey, R., Smayling, M.C. and Story, B.J.; Appl.Phys.A 56, 275 (1993).Google Scholar
8 Arenholz, E., Heitz, J., Wagner, M., Baëerle, D., Hilbst, H. and Hagemeyer, A.; Appl.Surf.Sci. 69, 16 (1993).Google Scholar
9 Srinivasan, R., Hall, R.R. and Albee, D.C.; Appl.Phys.Lett. 63, 3382 (1993).Google Scholar
10 Kokai, F., Saito, H. and Fujioka, T.; J.Appl.Phys. 66, 3252 (1989).Google Scholar