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Development of Evaluation Method for Delamination StrengthBetween Micro-Sized Materials in MEMS Devices

Published online by Cambridge University Press:  26 February 2011

Chiemi Ishiyama ,
Junichi Hata ,
Satoru Koyama ,
Masato Sone  and
Yakichi Higo
Chiemi Ishiyama
Affiliation:
ishiyama.c.aa@m.titech.ac.jp, Tokyo Institute of Technology, Precision and Intelligence Labratory, 4259 Nagatsuta, Midoriku, Yokohama, 226-8503, Japan
Junichi Hata
Affiliation:
hata.j.aa@ames.pi.titech.ac.jp, Tokyo Institute of Technology, Precision and Intelligence Labratory, 4259 Nagatsuta, Midoriku, Yokohama, 226-8503, Japan
Satoru Koyama
Affiliation:
koyama.s.ab@m.titech.ac.jp, Tokyo Institute of Technology, Precision and Intelligence Labratory, 4259 Nagatsuta, Midoriku, Yokohama, 226-8503, Japan
Masato Sone
Affiliation:
msone@pi.titech.ac.jp, Tokyo Institute of Technology, Precision and Intelligence Labratory, 4259 Nagatsuta, Midoriku, Yokohama, 226-8503, Japan
Yakichi Higo
Affiliation:
yhigo@pi.titech.ac.jp, Tokyo Institute of Technology, Precision and Intelligence Labratory, 4259 Nagatsuta, Midoriku, Yokohama, 226-8503, Japan
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Abstract

Evaluation method for delamination strength of micro-sized materials hasbeen developed using by FEM and measurement of load-displacement curve ofmicro-sized specimen. This evaluation method is applied to micro-sizedcylindrical SU-8 specimens on Si substrate. The maximum shear stress betweenSU-8 and Si was analyzed with FEM. Fracture load required to delaminate thetwo materials was examined using a mechanical testing machine formicro-sized materials, which have been developed in our group. Thedelamination strength was determined from the maximum shear stress and thefracture load.

Keywords

adhesionmicroelectro-mechanical (MEMS)strength

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References

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