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Development of New High-Mounting Density Packages

  • J. Kasai (a1), K. Tsuji (a1) and Y. Yoneda (a1)
Abstract

In low pin-count packages mounted with a device for portable electronics equipment, we have developed the CSP(Chip Size Package), which guarantees the reliability similar to the former SSOP (Shrink Small Outline Package) despite its drastic miniaturization in size than SSOP. The BCC (Bump Chip Carrier) we developed this time, as the name suggests, is a package with bumps, having the following structure: resin bumps covered with metal film are laid out in the base peripherally as mounted terminals. This resin bump can be formed by molding monolithically with resin sealing, and the connection between the bump and metal film has been implemented using lead frame manufacturing technology and etching technology we have developed. In this paper, we outline the structure and manufacturing technology of BCC as well as the results of reliability evaluation for BCC.

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References
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1 Yoneda, Y. et al. : TECHNICAL REPORT OF IEICE ICD95–199 (1995–12).
2 Kasai, J.: “Structure and Application Development of Leadframe Type CSP” INTERNEPCON JAPAN'96 (1996).
3 Kasai, J.: “Development and Micro BGA and QFN by Leadframe Terminal Division Method” First Pan Pacifie Micro Electronics Symposium (1996).
4 Kasai, J.: “LOW COST CHIP SIZE PACKAGE SOLUTIONS FOR ASIC AND MEMOLY APPLICATION” SEMICON EUROPA'96, SEMI TECHNICAL PROGRAM, March 27, 1996.
5 Tsuji, K.: “Development of Leadframe Type CSP by Terminal Formation Etching Method” JPCA SHOW 96 Institute of Circuit Technology Seminar Text, pp 1724 (1996).
6 Fujita, K.: Nikkei Electronics 1996.8.19 (no.668), pp139145.
7 Yoneda, Y.: 6th SHM WORKSHOP no. 18 (1996).
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MRS Online Proceedings Library (OPL)
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  • EISSN: 1946-4274
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