Hostname: page-component-848d4c4894-x24gv Total loading time: 0 Render date: 2024-05-08T19:15:20.048Z Has data issue: false hasContentIssue false

Direct Observation of Stacking Fault Nucleation from Deflected Threading Dislocations with Burgers Vector c+a in PVT Grown 4H-SiC

Published online by Cambridge University Press:  10 June 2014

Fangzhen Wu
Affiliation:
Department of Materials Science and Engineering, Stony Brook University, Stony Brook, NY, 11790, U.S.A.
Huanhuan Wang
Affiliation:
Department of Materials Science and Engineering, Stony Brook University, Stony Brook, NY, 11790, U.S.A.
Balaji Raghothamachar
Affiliation:
Department of Materials Science and Engineering, Stony Brook University, Stony Brook, NY, 11790, U.S.A.
Michael Dudley*
Affiliation:
Department of Materials Science and Engineering, Stony Brook University, Stony Brook, NY, 11790, U.S.A.
Stephan G. Mueller
Affiliation:
Dow Corning Compound Semiconductor Solutions, Midland, Michigan, 48686, U.S.A.
Gil Chung
Affiliation:
Dow Corning Compound Semiconductor Solutions, Midland, Michigan, 48686, U.S.A.
Edward K. Sanchez
Affiliation:
Dow Corning Compound Semiconductor Solutions, Midland, Michigan, 48686, U.S.A.
Darren Hansen
Affiliation:
Dow Corning Compound Semiconductor Solutions, Midland, Michigan, 48686, U.S.A.
Mark J. Loboda
Affiliation:
Dow Corning Compound Semiconductor Solutions, Midland, Michigan, 48686, U.S.A.
Get access

Abstract

In our previous studies [1-3], four kinds of stacking faults in 4H-SiC bulk crystal have been distinguished based on their contrast behavior differences in synchrotron white beam x-ray topography images. These faults are Shockley faults, Frank faults, Shockley plus c/2 Frank faults, and Shockley plus c/4 Frank faults. Our proposed formation mechanisms for these stacking faults involve the overgrowth of the surface outcrop associated with threading screw dislocations (TSDs) or threading mixed dislocations (TMDs) with Burgers vector of c+a by macrosteps and the consequent deflection of TSDs or TMDs onto the basal plane. Previous synchrotron x-ray topography observations were made in offcut basal wafers using transmission geometry. In this paper, further evidence is reported to confirm the proposed stacking fault formation mechanism. Observations are made in axially cut slices with surface plane {11-20}. Several kinds of stacking faults are recognized and their contrast behavior agrees with the four kinds previously reported. Direct observation is obtained of a Shockley plus c/4 Frank stacking fault nucleating from a TMD deflected onto the basal plane. The contrast from stacking faults on the basal plane in the axial slices is enhanced by recording images after rotating the crystal about the active -1010 reflection vector enabling a broader projection of the basal plane.

Type
Articles
Copyright
Copyright © Materials Research Society 2014 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Dudley, M., Byrappa, S., et al. ., MRS Proceedings , vol. 1246, 1246-B02-02 (2010).CrossRefGoogle Scholar
Dudley, M., Wang, H., et al. ., Mater. Sci. Forum , vols. 679-680, pp. 269272, (2011).CrossRefGoogle Scholar
Dudley, M., Wu, F., et al. ., Appl. Phys. Lett. , vol. 98, 232110 (2011).CrossRefGoogle Scholar
Singh, R. and Pecht, M., Iee Ind Electron M , vol. 2, pp1931 (2008).CrossRefGoogle Scholar
Leonard, R.T., Khlebnikov, Y., et al. ., Mater. Sci. Forum , vols. 600-603, pp. 710, (2009).Google Scholar
Wu, F., Wang, H., et al. ., Mater. Sci. Forum , vols. 717-720, pp. 343346, (2012).CrossRefGoogle Scholar
Wu, F., Wang, H., et al. ., Mater. Sci. Forum , vols. 740-742, pp. 217220, (2013).CrossRefGoogle Scholar
Chen, Y., Dudley, M., et al. ., J. Electron. Mater. , vol. 37, pp. 713720 (2008)CrossRefGoogle Scholar
Kamata, I., Nagano, M., et al. ., Mater. Sci. Forum , vols. 600-603, pp. 305308, (2009).Google Scholar
Huang, X. R., Black, D. R., et al. ., Appl. Phys. Lett., vol. 91, 231903 (2007).Google Scholar
Wu, F., Byrappa, S., et al. ., MRS Proceedings , vol. 1433, mrss12-1433-h02-04 (2012)CrossRefGoogle Scholar
Dudley, M., Huang, X. R., Huang, W., J. Phys. D: Appl. Phys. , 32 A139A144 (1999).CrossRefGoogle Scholar