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Edge Delamination Testing: A Method for Measuring the Adhesion of Thin-film Coatings in Microelectronic Applications Part 1: Numerical Analysis and Preliminary Results

Published online by Cambridge University Press:  15 February 2011

Edward O. Shaffer II ,
Frederick J. Mcgarry  and
Fred Trusell
Edward O. Shaffer II
Affiliation:
Massachusetts Institute of TechnologyDepartmentMaterials Science and Engineering Department, 8-209Department77 Massachusetts Ave.DepartmentCambridge, MA
Frederick J. Mcgarry
Affiliation:
Massachusetts Institute of TechnologyDepartmentMaterials Science and Engineering Department, 8-209Department77 Massachusetts Ave.DepartmentCambridge, MA
Fred Trusell
Affiliation:
Massachusetts Institute of TechnologyDepartmentMaterials Science and Engineering Department, 8-209Department77 Massachusetts Ave.DepartmentCambridge, MA
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Abstract

We propose a new test to measure the adhesion of thin polymeric coatings used in microelectronic applications. Similar to previous tests [1-3], the edge delamination test (EDT) takes advantage of the thermal residual stress present in the coating to induce delamination. However, in the EDT, we take advantage of lithography to fabricate test geometries that probe a complete range of debond energies. As a result, nearly a hundred adhesion tests can be performed on a single wafer. In this report, we apply finite element analysis to assess the debond energy generated at the coating/substrate interface to determine the feasibility of the test. The analysis also quantifies the effect of various geometries and boundary conditions. We apply the EDT to study the adhesion of Cyclotene™ 3022 polymer to silicon coated with evaporated aluminum. The critical mode I strain energy release rate for the Cyclotene/Aluminum interface with no adhesion promoter is 10.5±0.2 J/m2.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 535
Copyright
Copyright © Materials Research Society 1993

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References

REFERENCES

1 Evans, A. G., Drory, M. D. and Hu, M. S., J. Mater. Res., 3, 1043 (1988).CrossRefGoogle Scholar
2 Thouless, M.D., Cao, H. C. and Mataga, P. A., J. Mater. Res., 24, 1406 (1989).Google Scholar
3 Farris, R. J. and Bauer, C. L., J. Adhesion, 26, 293 (1988).CrossRefGoogle Scholar
4 Mittal, K., J. Adhesion Sci. Tech., 1, 3, 247 (1987).CrossRefGoogle Scholar
5 Kim, K.S. and Kim, J., Trans. IEEE, 110, 266 (1988).Google Scholar
6 Danneberg, H., J. Appl. Poly. Sci., 14, 125 (1961).CrossRefGoogle Scholar
7 Allen, M. G., PhD Thesis, Massachusetts Institute of Technology, (1989).Google Scholar
8 Beuth, J. L., "Cracking of Thin Bonded Films in Residual Tension" Division of Applied Sciences Report, Harvard University, Cambridge, MA (1990).Google Scholar
9 FEA calculations have shown that the crack is predmoninatly mode I, thus, for the puproses of this paper GI is considered as the critical failure criteria. A future paper will discuss the issue of mixity at the crack front.Google Scholar
10 Rybicki, and Kanninen, , Eng. Frac. Mech., 9, 931 (1977).CrossRefGoogle Scholar
11 Conversation of experimental results with G. Margaritis, MIT, 1993.Google Scholar
12 Burdeaux, D., Townsend, P., and Carr, J., J. Elect. Mater., 19, 1357 (1990).CrossRefGoogle Scholar