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Effect of Microstructure and Chemical Bonding on the Adhesion Strength of a Silicon/Polymer Interface for Microelectronic Packaging Applications

Published online by Cambridge University Press:  10 February 2011

Dimitrios Pantelidis ,
Hoo-Jeong Lee  and
John C. Bravman
Dimitrios Pantelidis
Affiliation:
Materials Science & Engineering Department, Stanford University, Stanford, CA 94305
Hoo-Jeong Lee
Affiliation:
Materials Science & Engineering Department, Stanford University, Stanford, CA 94305
John C. Bravman
Affiliation:
Materials Science & Engineering Department, Stanford University, Stanford, CA 94305
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Abstract

Interface reinforcement brought about by addition of a γ-amino-propyl-triethoxy-silane (γ-APS) adhesion promoter layer between a silicon wafer and a spun-on benzocyclobutene polymer (BCB) is investigated. Combining cross-sectional TEM and XPS, crack growth is shown to occur along the γ-APS/BCB interface. Ion etching and in-situ XPS are further employed to study chain orientation and chemical bonding variations through the silane layer. A tendency of the amide group to orient away from the wafer is documented and Si-O-Si siloxane bonding at the γ- APS/SiO2 interface is hypothesized as an important mechanism for adhesion strength enhancement.

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