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The Effect of Process on Performance and Reliability in a One Step Silver-Glass Die Attach Adhesive

Published online by Cambridge University Press:  26 February 2011

A.M. Conlon ,
C.P. Cameron  and
J.W. Lau
A.M. Conlon
Affiliation:
Emerson & Cuming, A GRACE Company, 25 Hartwell Ave., Lexington, MA 02173
C.P. Cameron
Affiliation:
W.R. Grace & Co., 7379 Rt. 32, Columbia MD 21044
J.W. Lau
Affiliation:
W.R. Grace & Co., 7379 Rt. 32, Columbia MD 21044
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Abstract

Silver-glass die attach adhesives provide a cost effective means of producing high reliability parts which can withstand the environmental testing required of electronic components. One step processing of these adhesives provides the additional advantages of increased throughput and processing flexibility compared to eutectically bonded assemblies.

This paper describes the performance of a one step silver-glass die attach adhesive processed under various time and temperature conditions. The effect of peak firing temperature and dwell time on the ultimate tensile strength of the adhesive will be discussed. Tensile data from parts subjected to thermal shock, thermal cycle and high temperature aging will be presented as an indication of the material's long term reliability.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 226: Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics , 1991 , 445
Copyright
Copyright © Materials Research Society 1991

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References

1. Chiang, S.S. and Shukla, R.K., “Failure Mechanism of Die Cracking Due to Imperfect Die Attachment”, Proceedings of the 34th Electronic Components Conference, IEEE, 1984 p. 195 Google Scholar
2. Moghadam, F.K., “Development of Adhesive Die Attach Technology in Cerdip Packages; Material Issues”, Solid State Technology, Jan. 1984, p. 149 Google Scholar
3. Owens, N.L., “Silver-Glass Die Attach and Large Area Dice”, Microelectronics Manufacturing and Testing, April 1988, p. 6 Google Scholar
4. Conlon, A.M. and Lau, J.W., “Novel Low Temperature Silver Glass Die Attach Adhesive”, Presented at the Third International Sampe Conference, June 1989 Google Scholar
5. Butts, A. and Cox, C.D., Silver, Economics, Metallurgy and Use c 1975, KreigerGoogle Scholar
6. Selvaduray, G.S., “Die Bonding Materials and Bonding Mechanisms in Microelectronic Packaging”, Presented at the Fourteenth International Conference on Metallurgical Coatings, March 1987 Google Scholar