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Effectiveness of Nitride Diffusion Barriers in a Self-Encapsulated Copper-Based Metallization.

Published online by Cambridge University Press:  25 February 2011

D. Adams ,
R.L. Spreitzer ,
S.W. Russell ,
N.D. Theodore ,
T.L. Alford  and
J.W. Mayer
D. Adams
Affiliation:
Department of Chemical, Bio and Materials Engineering, Arizona State University, AZ, 85287 - 6006.
R.L. Spreitzer
Affiliation:
Department of Chemical, Bio and Materials Engineering, Arizona State University, AZ, 85287 - 6006.
S.W. Russell
Affiliation:
Department of Chemical, Bio and Materials Engineering, Arizona State University, AZ, 85287 - 6006.
N.D. Theodore
Affiliation:
Department of Chemical, Bio and Materials Engineering, Arizona State University, AZ, 85287 - 6006.
T.L. Alford
Affiliation:
Department of Chemical, Bio and Materials Engineering, Arizona State University, AZ, 85287 - 6006.
J.W. Mayer
Affiliation:
Center of Solid State Science, Arizona State University, AZ, 85287-1704.
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Abstract

Cu(Ti 27 at. %) and Cu(Cr 26 at. %) codeposited on silicon dioxide substrates were annealed in a flowing NH3 ambient at 400 - 600°C for 30 min. The Ti segregates to both the surface to form a TiN(O) layer and to the alloy/SiO2 interface to form a Ti-oxide/Ti-silicide bilayer. The Cr seems to migrate only to the free surface to form a CrNx layer. A 45 nm - thick Al film was deposited after nitridation, whereupon a second anneal was performed to evaluate these nitride layers as diffusion barriers. It was found that the Ti-nitride was stable up to 500°C as compared to Cr-nitride at 600°C.

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References

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