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Electromigration Lifetime and Step Coverage in Al/Cu/Si Thin Film Conductors

Published online by Cambridge University Press:  15 February 2011

Larisa Kisselgof ,
L. J. Elliott ,
J. J. Maziarz  and
J. R. Lloyd
Larisa Kisselgof
Affiliation:
Digital Equipment Corporation 77 Reed Road Hudson MA 01749-2895
L. J. Elliott
Affiliation:
Digital Equipment Corporation 77 Reed Road Hudson MA 01749-2895
J. J. Maziarz
Affiliation:
Digital Equipment Corporation 77 Reed Road Hudson MA 01749-2895
J. R. Lloyd
Affiliation:
Digital Equipment Corporation 77 Reed Road Hudson MA 01749-2895
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Abstract

Electromigration-induced failure was investigated in Al/Cu/Si conductor stripes deposited over trenches cut into an oxide layer and compared with those deposited onto flat areas. The results indicate a reduction in lifetime which is proportional to the size of the step to be covered and this reduction is in excess of what is expected from simple current density scaling. In addition, the electromigration performance of conductors deposited over topology did not correlate well with the performance on flat structures.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 225: Symposium G – Materials Reliability Issues in Microelectronics , 1991 , 107
Copyright
Copyright © Materials Research Society 1991

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References

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