Hostname: page-component-848d4c4894-x5gtn Total loading time: 0 Render date: 2024-06-09T20:03:20.502Z Has data issue: false hasContentIssue false

Epitaxial Phases Formation Due to Interaction Between Ni Thin Films and GaAs

Published online by Cambridge University Press:  26 February 2011

A. Lahav
Affiliation:
Dept. of Materials Engineering, Technion, Haifa 32000, Israel
M. Eizenberg
Affiliation:
Dept. of Materials Engineering, Technion, Haifa 32000, Israel
Y. Komem
Affiliation:
Dept. of Materials Engineering, Technion, Haifa 32000, Israel
Get access

Abstract

Solid state reactions between Ni thin films and (100) GaAs were studied by transmission electron microscopy, X-ray diffraction, Auger electron spectroscopy and Rutherford backscattering. The hexagonal ternary phase Ni2GaAs is formed at the temperature range of 150 to 300°C with the following epitaxial relations to the substrate: (1011)//(001) and [1011]//[100]. The gradual decrease with temperature of the (1011)interplanar spacing of this phase may be related to strain relaxation associated with microtwins formation. At the temperature range of 350 to 550°C precipitation of NiAs in Ni2GaAs matrix and an increase of the twin size are observed. In this range the (1011) interplanar spacing of the ternary phase increases with temperature, possibly due to stoichiometric changes resulting from NiAs precipitation. At 600°C the ternary phase decomposes into NiGa and NiAs with average grain size of about 1 micron in lateral dimension. The cubic phase, NiGa, has simple epitaxial relations with GaAs: (001)//(001) and [010]//[010].Ni atoms are the dominant diffusing species during the ternary phase growth process as was observed in a marker experiment utilizing a very thin Ta Layer interposed between the Ni film and the substrate.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Tu, K.N. in “Preparation and Properties of Thin Films” - Treatise on Materials Science and Technology, V.24, Ed. by Tu, K.N. and Rosenberg, R., Academic Press, Chapter 7, 237, (1982).Google Scholar
2. Murarka, S.P., “Silicides for VLSI Applications”, Academic Press, (1983).Google Scholar
3. Eizenberg, M. in “VLSI Science and Technology 1984”, Ed. by Bean, K.E. and Rozgonyi, G.A., The Electrochemical Society, Pennington, 348, (1984).Google Scholar
4. Braslau, N., J. Vac. Sci. Technol. 19, 803 (1981).CrossRefGoogle Scholar
5. Ogawa, M., Thin Solid Films, 70, 181, (1980).Google Scholar
6. Barrett, C. and Massalski, T.B., “Structure of Metals”, 3rd ed. Pergamon Press, (1980).Google Scholar
7. Scobey, I.H., Wallace, C.A. and Ward, R.C.C., J. Appl. Cryst., 6, 425, (1973).10.1107/S0021889873009167CrossRefGoogle Scholar
8. Lahav, A. and Eizenberg, M., Appl. Phys. Lett., 45, 256 (1984).CrossRefGoogle Scholar
9. Farrow, R.F.C., J. Vac. Sci. Technol. B 1 (2), 222 (1983).Google Scholar